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1. (WO2019066993) WARPAGE MITIGATION STRUCTURES CREATED ON SUBSTRATE USING HIGH THROUGHPUT ADDITIVE MANUFACTURING
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CLAIMS

What is claimed is:

1. A device package, comprising:

a substrate having one or more dies disposed on the substrate, wherein each die has a bottom surface that is electrically coupled to the substrate and a top surface that is opposite from the bottom surface; and

a plurality of stiffeners disposed directly on the substrate.

2. The device package of claim 1 , wherein the plurality of stiffeners are directly attached to a top surface of the substrate without an adhesive layer.

3. The device package of claim 1 , wherein the plurality of stiffeners include one or more different sizes, and wherein the plurality of stiffeners further include one or more different shapes, including at least one of a rectangular stiffener, a picture frame stiffener, a L-shaped stiffener, a H-shaped stiffener, and a round pillar stiffener.

4. The device package of claim 1 , wherein the plurality of stiffeners include one or more materials, and wherein the one or more materials include at least one or more of metals, metal alloys, metal-ceramic composites, polymers, polymer-metal composites, polymer-ceramic composites, epoxy, and ceramics.

5. The device package of claim 2, wherein the plurality of stiffeners are disposed on the top surface of the substrate using a cold spray process.

6. The device package of claim 1 , further comprising a mold layer formed around and over the one or more dies, the plurality of stiffeners, and the top surface of the substrate.

7. The device package of claim 1 , wherein at least one of the plurality of dies is disposed on another of the dies on the substrate.

8. The device package of claim 1 , further comprising a plurality of solder balls electrically coupling the bottom surface of each die to the substrate.

9. The device package of claim 1, wherein the plurality of stiffeners further includes a first set of stiffeners disposed directly on a top surface of a die, a second set of stiffeners disposed directly on both the top surface of the die and the top surface of the substrate, and a third set of stiffeners disposed directly on the top surface of the substrate, and wherein the first and second sets of stiffeners are disposed on the top surface of the die without an adhesive layer.

10. The device package of claim 1, wherein the substrate is a printed circuit board.

11. A method of forming a device package, comprising:

disposing one or more dies on a substrate, wherein each die has a bottom surface that is electrically coupled to the substrate and a top surface that is opposite from the bottom surface; and

disposing a plurality of stiffeners directly on the substrate.

12. The method of claim 11, wherein the plurality of stiffeners are directly attached to a top surface of the substrate without an adhesive layer.

13. The method of claim 11, wherein the plurality of stiffeners include one or more different sizes, and wherein the plurality of stiffeners further include one or more different shapes, including at least one of a rectangular stiffener, a picture frame stiffener, a L-shaped stiffener, a H-shaped stiffener, and a round pillar stiffener.

14. The method of claim 11, wherein the plurality of stiffeners include one or more materials, and wherein the one or more materials include at least one or more of metals, metal alloys, metal-ceramic composites, polymers, polymer-metal composites, polymer-ceramic composites, epoxy, and ceramics.

15. The method of claim 12, wherein the plurality of stiffeners are disposed on the top surface

of the substrate using a cold spray process.

16. The method of claim 11, further comprising forming a mold layer around and over the one or more dies, the plurality of stiffeners, and the top surface of the substrate.

17. The method of claim 11, wherein at least one of the plurality of dies is disposed on

another of the dies on the substrate.

18. The method of claim 1 1, further comprising electrically coupling the bottom surface of each

die to the substrate with a plurality of solder balls.

19. The method of claim 1 1, wherein the plurality of stiffeners further includes a first set of stiffeners disposed directly on a top surface of a die, a second set of stiffeners disposed directly on both the top surface of the die and the top surface of the substrate, and a third set of stiffeners disposed directly on the top surface of the substrate, and wherein the first and second sets of stiffeners are disposed on the top surface of the die without an adhesive layer.

20. A device package, comprising:

a substrate having one or more dies disposed on the substrate, wherein each die has a bottom surface that is electrically coupled to the substrate and a top surface that is opposite from the bottom surface;

a plurality of stiffeners disposed directly on the substrate; and

a mold layer formed around and over the one or more dies, the plurality of stiffeners, and the substrate.

21. The device package of claim 20, wherein the plurality of stiffeners are directly attached to a

top surface of the substrate without an adhesive layer, wherein the plurality of stiffeners are disposed on the top surface of the substrate using a cold spray process, wherein the plurality of stiffeners include one or more different sizes, and wherein the plurality of stiffeners further include one or more different shapes, including at least one of a rectangular stiffener, a picture frame stiffener, a L-shaped stiffener, a H-shaped stiffener, and a round pillar stiffener.

22. The device package of claim 20, wherein the plurality of stiffeners include one or more materials, and wherein the one or more materials include at least one or more of metals, metal alloys, metal-ceramic composites, polymers, polymer-metal composites, polymer-ceramic composites, epoxy, and ceramics.

23. The device package of claim 20, wherein at least one of the plurality of dies is disposed on

another of the dies on the substrate.

24. The device package of claim 20, further comprising a plurality of solder balls electrically coupling the bottom surface of each die to the substrate.

25. The device package of claim 20, wherein the plurality of stiffeners further includes a first set of stiffeners disposed directly on a top surface of a die, a second set of stiffeners disposed directly on both the top surface of the die and the top surface of the substrate, and a third set of stiffeners disposed directly on the top surface of the substrate, and wherein the first and second sets of stiffeners are disposed on the top surface of the die without an adhesive layer.