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1. (WO2016112375) PREPARATION AND APPLICATION OF PB-FREE NANOSOLDER

Pub. No.:    WO/2016/112375    International Application No.:    PCT/US2016/012810
Publication Date: Fri Jul 15 01:59:59 CEST 2016 International Filing Date: Tue Jan 12 00:59:59 CET 2016
IPC: B23K 35/02
B23K 35/22
B23K 31/02
H05K 13/04
B23K 3/00
H01R 43/02
Applicants: UNIVERSITY OF MASSACHUSETTS
Inventors: GU, Zhiyong
GAO, Fan
WERNICKI, Evan
CAMPELLI, Jonathan
Title: PREPARATION AND APPLICATION OF PB-FREE NANOSOLDER
Abstract:
The preparation and use of particulate metallic solder alloy having particles of a single chemical composition is described. The particles of the particulate metallic solder alloy have a bimodal size distribution in which particles in a smaller size range have a largest dimension that is smaller than a smallest dimension of particles in a larger size range of the bimodal distribution. In some examples the particles in the smaller size mode have dimensions in the range of 1 to 100 nm. In some examples, the particles in the larger size mode have dimensions in the range of 2 to 75 microns in dimension. In some examples, a halogen-free flux is used. In some examples, a solvent is used to make a paste.