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1. CN108156354 - Chip component of camera, camera and electronic device

Office
Chine
Numéro de la demande 201711378212.3
Date de la demande 19.12.2017
Numéro de publication 108156354
Date de publication 12.06.2018
Type de publication A
CIB
H04N 5/225
HÉLECTRICITÉ
04TECHNIQUE DE LA COMMUNICATION ÉLECTRIQUE
NTRANSMISSION D'IMAGES, p.ex. TÉLÉVISION
5Détails des systèmes de télévision
222Circuits de studio; Dispositifs de studio; Equipements de studio
225Caméras de télévision
H04M 1/02
HÉLECTRICITÉ
04TECHNIQUE DE LA COMMUNICATION ÉLECTRIQUE
MCOMMUNICATIONS TÉLÉPHONIQUES
1Équipement de sous-station, p.ex. pour utilisation par l'abonné
02Caractéristiques de structure des appareils téléphoniques
CPC
H04M 1/0264
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
MTELEPHONIC COMMUNICATION
1Substation equipment, e.g. for use by subscribers
02Constructional features of telephone sets
0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
026Details of the structure or mounting of specific components
0264for a camera module assembly
H04N 5/2251
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
225Television cameras ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
2251Constructional details
H04N 5/2254
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
225Television cameras ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
2251Constructional details
2254Mounting of optical parts, e.g. lenses, shutters, filters or optical parts peculiar to the presence or use of an electronic image sensor
H04N 5/2257
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
225Television cameras ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
2257Mechanical and electrical details of cameras or camera modules for embedding in other devices
Déposants GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
广东欧珀移动通信有限公司
Inventeurs WEI YI
韦怡
Mandataires 北京清亦华知识产权代理事务所(普通合伙) 11201
Titre
(EN) Chip component of camera, camera and electronic device
(ZH) 摄像头的芯片组件、摄像头及电子设备
Abrégé
(EN)
The invention discloses a chip component of a camera, the camera and an electronic device. The chip component of the camera comprises: a filter disc; a chip; a substrate, wherein the substrate, the chip and the filter disc are stacked, the substrate is located on one side of the chip, the filter disc is located on the other side of the chip, and the filter disc is spaced from the chip; and a package part used for packaging the filter disc and the chip in the substrate, wherein at least a part of the edge of the filter disc is wrapped by the package part. According to the chip component of thecamera disclosed by the invention, the filter disc, the chip and the substrate are packaged into an integrated structure by using the package part, so that the filter disc can be effectively preventedfrom falling off under the impact of an external force, the working stability of the filter disc is enhanced, the attachment procedure of the filter disc is omitted, the assembly accuracy of the chipcomponent is improved, and assembly errors generated in a package process are reduced. In addition, a structure for fixing the filter disc to the chip component by using a bracket in related art is cancelled, thereby reducing the volume and the size of the chip component.

(ZH)
本发明公开了一种摄像头的芯片组件、摄像头及电子设备,其中摄像头的芯片组件包括:滤片;芯片;基板,基板、芯片和滤片层叠设置,基板位于芯片的一侧,滤片位于芯片的另一侧,滤片与芯片间隔开;用于将滤片和芯片封装至基板的封装部,滤片的至少部分边缘被封装部包裹。根据本发明的摄像头的芯片组件,通过利用封装部将滤片、芯片以及基板封装成一体式结构,可有效防止滤片在外力冲击下发生脱落,增强了滤片工作的稳定性,省略了滤片的贴附工序,提升了芯片组件的装配精度,减少了封装过程产生的装配误差。此外,取消了相关技术中的利用支架将滤片固定到芯片组件上的结构,缩小了芯片组件的体积和尺寸。

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