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1. CN106129024 - Heat-radiation-design-based power semiconductor device module

Office Chine
Numéro de la demande 201610676666.8
Date de la demande 16.08.2016
Numéro de publication 106129024
Date de publication 16.11.2016
Type de publication A
CIB
H01L 23/36
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
23Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
34Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température
36Emploi de matériaux spécifiés ou mise en forme, en vue de faciliter le refroidissement ou le chauffage, p.ex. dissipateurs de chaleur
CPC
H01L 23/36
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
Déposants ZHONGSHAN DAXIANG POWER TECHNOLOGY CO., LTD.
Inventeurs QIN JING
Titre
(EN) Heat-radiation-design-based power semiconductor device module
Abrégé
(EN)
The invention, which belongs to the power semiconductor device field, relates to a heat-radiation-design-based power semiconductor device module comprising a power semiconductor device, a metal radiator and a PCB substrate. An opening is formed in the PCB substrate; a circuit of the power semiconductor device is arranged at the front side of the PCB substrate; the back side of the PCB substrate is fixed on the metal radiator; the power semiconductor device is fixed on the metal radiator in the opening; and a pin of the power semiconductor device is welded to the circuit. The heat-radiation-design-based power semiconductor device module is applied to associated fields of the power semiconductor device; and an integrated design of the PCB substrate and the metal radiator can be realized and the heat radiation effect is improved. With the module, the common PCB substrate can be used for replacing an aluminum substrate, thereby lowering the cost. Besides, a cooper bar is used as a heat radiator, so that heat radiation is realized and the copper bar can be used as a power line to realize a current carrying effect.