(EN) The invention, which belongs to the power semiconductor device field, relates to a heat-radiation-design-based power semiconductor device module comprising a power semiconductor device, a metal radiator and a PCB substrate. An opening is formed in the PCB substrate; a circuit of the power semiconductor device is arranged at the front side of the PCB substrate; the back side of the PCB substrate is fixed on the metal radiator; the power semiconductor device is fixed on the metal radiator in the opening; and a pin of the power semiconductor device is welded to the circuit. The heat-radiation-design-based power semiconductor device module is applied to associated fields of the power semiconductor device; and an integrated design of the PCB substrate and the metal radiator can be realized and the heat radiation effect is improved. With the module, the common PCB substrate can be used for replacing an aluminum substrate, thereby lowering the cost. Besides, a cooper bar is used as a heat radiator, so that heat radiation is realized and the copper bar can be used as a power line to realize a current carrying effect.