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1. WO2020244890 - PROCÉDÉ DE MANIPULATION DE PLAQUETTES MEMS

Numéro de publication WO/2020/244890
Date de publication 10.12.2020
N° de la demande internationale PCT/EP2020/063071
Date du dépôt international 11.05.2020
CIB
B41J 2/16 2006.1
BTECHNIQUES INDUSTRIELLES; TRANSPORTS
41IMPRIMERIE; LIGNARDS; MACHINES À ÉCRIRE; TIMBRES
JMACHINES À ÉCRIRE; MÉCANISMES D'IMPRESSION SÉLECTIVE, c. à d. MÉCANISMES IMPRIMANT AUTREMENT QUE PAR UTILISATION DE FORMES D'IMPRESSION; CORRECTION D'ERREURS TYPOGRAPHIQUES
2Machines à écrire ou mécanismes d'impression sélective caractérisés par le procédé d'impression ou de marquage pour lequel ils sont conçus
005caractérisés par la mise en contact sélective d'un liquide ou de particules avec un matériau d'impression
01à jet d'encre
135Ajutages
16Fabrication d'ajutages
CPC
B41J 2/16
BPERFORMING OPERATIONS; TRANSPORTING
41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, ; e.g. INK-JET PRINTERS, THERMAL PRINTERS; , i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
005characterised by bringing liquid or particles selectively into contact with a printing material
01Ink jet
135Nozzles
16Production of nozzles
B41J 2/1623
BPERFORMING OPERATIONS; TRANSPORTING
41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, ; e.g. INK-JET PRINTERS, THERMAL PRINTERS; , i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
005characterised by bringing liquid or particles selectively into contact with a printing material
01Ink jet
135Nozzles
16Production of nozzles
1621manufacturing processes
1623bonding and adhesion
B41J 2/1628
BPERFORMING OPERATIONS; TRANSPORTING
41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, ; e.g. INK-JET PRINTERS, THERMAL PRINTERS; , i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
005characterised by bringing liquid or particles selectively into contact with a printing material
01Ink jet
135Nozzles
16Production of nozzles
1621manufacturing processes
1626etching
1628dry etching
B41J 2/1631
BPERFORMING OPERATIONS; TRANSPORTING
41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, ; e.g. INK-JET PRINTERS, THERMAL PRINTERS; , i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
005characterised by bringing liquid or particles selectively into contact with a printing material
01Ink jet
135Nozzles
16Production of nozzles
1621manufacturing processes
1631photolithography
B41J 2/1632
BPERFORMING OPERATIONS; TRANSPORTING
41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, ; e.g. INK-JET PRINTERS, THERMAL PRINTERS; , i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
005characterised by bringing liquid or particles selectively into contact with a printing material
01Ink jet
135Nozzles
16Production of nozzles
1621manufacturing processes
1632machining
B41J 2/1635
BPERFORMING OPERATIONS; TRANSPORTING
41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, ; e.g. INK-JET PRINTERS, THERMAL PRINTERS; , i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
005characterised by bringing liquid or particles selectively into contact with a printing material
01Ink jet
135Nozzles
16Production of nozzles
1621manufacturing processes
1635dividing the wafer into individual chips
Déposants
  • MEMJET TECHNOLOGY LIMITED [IE]/[IE]
Inventeurs
  • ARNAL, Nicolas
  • QUIMPO, Troy, Pasiola
  • NORTH, Angus
Données relatives à la priorité
62/856,62703.06.2019US
Langue de publication Anglais (en)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) PROCESS FOR HANDLING MEMS WAFERS
(FR) PROCÉDÉ DE MANIPULATION DE PLAQUETTES MEMS
Abrégé
(EN) A process for handling MEMS wafers includes the steps of: (i) attaching a first carrier substrate to a first side of a MEMS wafer, the first carrier substrate being attached via a first wafer bonding tape and a silicone-free peel tape, the peel tape contacting the first side of the MEMS wafer; (ii) performing wafer processing steps on an opposite second side of the MEMS wafer; (iii) releasing the first carrier substrate from the first side of the MEMS wafer via exposure to an energy source, the energy source selectively releasing the wafer bonding tape from the first side of the MEMS wafer; and (iv) peeling the peel tape away from the first side of the MEMS wafer.
(FR) La présente invention concerne un procédé de manipulation de plaquettes MEMS qui comprend les étapes consistant : (i) à fixer un premier substrat porteur à un premier côté d'une plaquette MEMS, le premier substrat porteur étant fixé par l'intermédiaire d'une première bande de liaison de plaquette et d'une bande de décollement sans silicone, la bande de décollement étant en contact avec le premier côté de la plaquette MEMS ; (ii) à réaliser des étapes de traitement de plaquette sur un second côté opposé de la plaquette MEMS ; (iii) à libérer le premier substrat porteur à partir du premier côté de la plaquette MEMS par l'intermédiaire d'une exposition à une source d'énergie, la source d'énergie libérant de manière sélective la bande de liaison de plaquette à partir du premier côté de la plaquette MEMS ; et (iv) à décoller la bande de décollement à l'opposé du premier côté de la plaquette MEMS.
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