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1. WO2016118457 - BOÎTIER COMPOSITE À STRUCTURE SANDWICH D'APPAREIL

Numéro de publication WO/2016/118457
Date de publication 28.07.2016
N° de la demande internationale PCT/US2016/013814
Date du dépôt international 19.01.2016
Demande présentée en vertu du Chapitre 2 22.11.2016
CIB
H01L 23/40 2006.01
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
23Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
34Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température
40Supports ou moyens de fixation pour les dispositifs de refroidissement ou de chauffage amovibles
CPC
G06F 1/1626
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/00G06F13/00 and G06F21/00
16Constructional details or arrangements
1613for portable computers
1626with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
G06F 1/1643
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/00G06F13/00 and G06F21/00
16Constructional details or arrangements
1613for portable computers
1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
1637Details related to the display arrangement, including those related to the mounting of the display in the housing
1643the display being associated to a digitizer, e.g. laptops that can be used as penpads
G06F 1/1658
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/00G06F13/00 and G06F21/00
16Constructional details or arrangements
1613for portable computers
1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
1656Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
1658related to the mounting of internal components, e.g. disc drive or any other functional module
G06F 1/203
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/00G06F13/00 and G06F21/00
16Constructional details or arrangements
20Cooling means
203for portable computers, e.g. for laptops
G06F 3/041
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
3Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01Input arrangements or combined input and output arrangements for interaction between user and computer
03Arrangements for converting the position or the displacement of a member into a coded form
041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
G06F 3/0412
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
3Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01Input arrangements or combined input and output arrangements for interaction between user and computer
03Arrangements for converting the position or the displacement of a member into a coded form
041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
0412Digitisers structurally integrated in a display
Déposants
  • MICROSOFT TECHNOLOGY LICENSING, LLC [US]/[US]
Inventeurs
  • JENKINS, Kurt A.
  • BURRESS, Edward
  • NARAIN, Jaya
  • BERGESON, Robert J.
  • HILL, Andrew W.
  • STELLMAN, Taylor
Mandataires
  • MINHAS, Sandip
  • GODDAR, Heinz
Données relatives à la priorité
14/603,14222.01.2015US
Langue de publication anglais (EN)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) DEVICE SANDWICH STRUCTURED COMPOSITE HOUSING
(FR) BOÎTIER COMPOSITE À STRUCTURE SANDWICH D'APPAREIL
Abrégé
(EN)
The description relates to devices, such as computing devices. One example can include a sandwich structured composite housing. The example can also include a set of electronic components positioned over the sandwich structured composite housing. The set of electronic components can have a profile against the sandwich structured composite housing. The sandwich structured composite housing can have a corresponding negative profile.
(FR)
L'invention concerne des appareils tels que des appareils informatiques. Un mode de réalisation peut comprendre un boîtier composite à structure sandwich. Le mode de réalisation peut également comprendre un ensemble de composants électroniques disposés sur le boîtier composite à structure sandwich. L'ensemble de composants électroniques peut présenter un profil contre le boîtier composite à structure sandwich. Le boîtier composite à structure sandwich peut présenter un profil négatif correspondant.
Également publié en tant que
Dernières données bibliographiques dont dispose le Bureau international