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1. WO2012012234 - BOÎTIER DE RÉSEAU DE LED MUNI D'UNE PLAQUE À FORTE CONDUCTION THERMIQUE

Numéro de publication WO/2012/012234
Date de publication 26.01.2012
N° de la demande internationale PCT/US2011/043809
Date du dépôt international 13.07.2011
CIB
H01L 33/48 2010.01
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
33Dispositifs à semi-conducteurs ayant au moins une barrière de potentiel ou une barrière de surface, spécialement adaptés pour l'émission de lumière; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Détails
48caractérisés par les éléments du boîtier des corps semi-conducteurs
CPC
F21K 9/00
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
9Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
F21K 9/64
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
9Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
64using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
F21Y 2115/10
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
2115Light-generating elements of semiconductor light sources
10Light-emitting diodes [LED]
H01L 25/0753
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
075the devices being of a type provided for in group H01L33/00
0753the devices being arranged next to each other
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H01L 33/507
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
50Wavelength conversion elements
507the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
Déposants
  • BRIDGELUX, INC. [US/US]; 101 Portola Avenue Livermore, CA 94551-7555, US (AllExceptUS)
  • LI, Jianhua [US/US]; US (UsOnly)
  • HELBING, Rene [US/US]; US (UsOnly)
  • HUM, David [US/US]; US (UsOnly)
Inventeurs
  • LI, Jianhua; US
  • HELBING, Rene; US
  • HUM, David; US
Mandataires
  • GELFOUND, Craig, A.; Arent Fox LLP 555 West Fifth Street, 48th Floor Los Angeles, CA 90013, US
Données relatives à la priorité
12/838,68619.07.2010US
Langue de publication anglais (EN)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) LED ARRAY PACKAGE WITH A HIGH THERMALLY CONDUCTIVE PLATE
(FR) BOÎTIER DE RÉSEAU DE LED MUNI D'UNE PLAQUE À FORTE CONDUCTION THERMIQUE
Abrégé
(EN)
A light source includes a substrate, a light emitting diode on the substrate, and a plate supporting member attached to the substrate and surrounding the light emitting diode to form a cavity. In addition, the light source includes a plate on the plate supporting member such that a distance between the plate and the substrate is approximately less than or equal to 1 mm. Furthermore, the light source includes a phosphor layer on the plate opposite the cavity.
(FR)
L'invention concerne une source de lumière comprenant un substrat, une diode électroluminescente sur le substrat et un élément support de plaque fixé au substrat et entourant la diode électroluminescente pour former une cavité. La source de lumière comprend en outre une plaque sur l'élément support de plaque de telle sorte qu'une distance entre la plaque et le substrat est approximativement égale ou inférieure à 1 mm. La source de lumière inclut en outre une couche de phosphore sur la plaque à l'opposé de la cavité.
Dernières données bibliographiques dont dispose le Bureau international