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Paramétrages

1. WO2012011562 - DISPOSITIF DE RAYONNEMENT DE LUMIÈRE, MODULE DE RAYONNEMENT DE LUMIÈRE ET DISPOSITIF D'IMPRESSION

Numéro de publication WO/2012/011562
Date de publication 26.01.2012
N° de la demande internationale PCT/JP2011/066690
Date du dépôt international 22.07.2011
CIB
H01L 33/64 2010.01
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
33Dispositifs à semi-conducteurs ayant au moins une barrière de potentiel ou une barrière de surface, spécialement adaptés pour l'émission de lumière; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Détails
48caractérisés par les éléments du boîtier des corps semi-conducteurs
64Éléments d'extraction de la chaleur ou de refroidissement
B41J 2/01 2006.01
BTECHNIQUES INDUSTRIELLES; TRANSPORTS
41IMPRIMERIE; LIGNARDS; MACHINES À ÉCRIRE; TIMBRES
JMACHINES À ÉCRIRE; MÉCANISMES D'IMPRESSION SÉLECTIVE, c. à d. MÉCANISMES IMPRIMANT AUTREMENT QUE PAR UTILISATION DE FORMES D'IMPRESSION; CORRECTION D'ERREURS TYPOGRAPHIQUES
2Machines à écrire ou mécanismes d'impression sélective caractérisés par le procédé d'impression ou de marquage pour lequel ils sont conçus
005caractérisés par la mise en contact sélective d'un liquide ou de particules avec un matériau d'impression
01à jet d'encre
CPC
B41J 11/002
BPERFORMING OPERATIONS; TRANSPORTING
41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, ; e.g. INK-JET PRINTERS, THERMAL PRINTERS; , i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
11Devices or arrangements ; of selective printing mechanisms, e.g. ink-jet printers, thermal printers,; for supporting or handling copy material in sheet or web form
0015for treating before, during or after printing or for uniform coating or laminating the copy material before or after printing
002Heating or irradiating, e.g. by UV or IR, or drying of copy material
B41J 2/45
BPERFORMING OPERATIONS; TRANSPORTING
41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, ; e.g. INK-JET PRINTERS, THERMAL PRINTERS; , i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
435characterised by selective application of radiation to a printing material or impression-transfer material
447using arrays of radiation sources
45using light-emitting diode ; [LED] or laser; arrays
H01L 2224/32245
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
321Disposition
32151the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
32221the body and the item being stacked
32245the item being metallic
H01L 2224/45124
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
45099Material
451with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
45117the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
45124Aluminium (Al) as principal constituent
H01L 2224/45144
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
45099Material
451with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
45138the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
45144Gold (Au) as principal constituent
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
Déposants
  • 京セラ株式会社 KYOCERA CORPORATION [JP/JP]; 京都府京都市伏見区竹田鳥羽殿町6番地 6, Takeda Tobadono-cho, Fushimi-ku, kyoto-shi, Kyoto 6128501, JP (AllExceptUS)
  • 田口 明 TAGUCHI, Akira [JP/JP]; JP (UsOnly)
Inventeurs
  • 田口 明 TAGUCHI, Akira; JP
Données relatives à la priorité
2010-16586223.07.2010JP
Langue de publication japonais (JA)
Langue de dépôt japonais (JA)
États désignés
Titre
(EN) LIGHT IRRADIATION DEVICE, LIGHT IRRADIATION MODULE, AND PRINTING DEVICE
(FR) DISPOSITIF DE RAYONNEMENT DE LUMIÈRE, MODULE DE RAYONNEMENT DE LUMIÈRE ET DISPOSITIF D'IMPRESSION
(JA) 光照射デバイス、光照射モジュール、および印刷装置
Abrégé
(EN)
Disclosed is a light irradiation device comprising a light emitting element, and a base whereon the light emitting element is mounted. The base has a laminated body with a plurality of laminated insulating layers, a first heat transfer member provided in the laminated body such that part thereof is positioned immediately under the light-emitting element, and a second heat transfer member provided between the insulating layers so as to surround the first heat transfer body when viewed from above. The thermal conductivity of the first heat transfer member and the second heat transfer member is better than the thermal conductivity of the laminated body.
(FR)
L'invention concerne un dispositif de rayonnement de lumière qui comprend un élément émetteur de lumière, et une base sur laquelle est installé ledit élément émetteur de lumière. La base présente un corps stratifié à plusieurs couches isolantes stratifiées, un premier élément de transfert thermique prévu dans le corps stratifié de façon qu'une partie de celui-ci soit immédiatement positionnée sous l'élément émetteur de lumière, et un second élément de transfert thermique prévu entre les couches isolantes de manière à entourer le premier corps de transfert thermique vu de dessus. La conductivité thermique des premier et second éléments de transfert thermique est meilleure que la conductivité thermique du corps stratifié.
(JA)
 本発明の一実施形態に係る光照射デバイスは、発光素子と、該発光素子が載置された基体とを備える。前記基体は、複数の絶縁層が積層されてなる積層体と、一部が前記発光素子の直下に位置するように前記積層体内に配設されている第1の伝熱部材と、平面視で該第1の伝熱部材を取り囲むように前記絶縁層間に配設された第2の伝熱部材とを有する。前記第1の伝熱部材および前記第2の伝熱部材の熱伝導率は、前記積層体の熱伝導率よりも高い。
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