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1. WO2012005984 - BOÎTIERS DE DISPOSITIFS ÉLECTROLUMINESCENTS À TRANSFERT THERMIQUE AMÉLIORÉ

Numéro de publication WO/2012/005984
Date de publication 12.01.2012
N° de la demande internationale PCT/US2011/041833
Date du dépôt international 24.06.2011
CIB
F21V 29/00 2006.01
FMÉCANIQUE; ÉCLAIRAGE; CHAUFFAGE; ARMEMENT; SAUTAGE
21ÉCLAIRAGE
VCARACTÉRISTIQUES FONCTIONNELLES OU DÉTAILS FONCTIONNELS DES DISPOSITIFS OU SYSTÈMES D'ÉCLAIRAGE; COMBINAISONS STRUCTURALES DE DISPOSITIFS D'ÉCLAIRAGE AVEC D'AUTRES OBJETS, NON PRÉVUES AILLEURS
29Protection des dispositifs d'éclairage contre les détériorations thermiques; Dispositions de refroidissement ou de chauffage spécialement adaptées aux dispositifs ou systèmes d'éclairage
CPC
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48247
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48245the item being metallic
48247connecting the wire to a bond pad of the item
H01L 2224/49113
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
49of a plurality of wire connectors
491Disposition
4911the connectors being bonded to at least one common bonding area, e.g. daisy chain
49113the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
H01L 25/0753
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
075the devices being of a type provided for in group H01L33/00
0753the devices being arranged next to each other
H01L 2924/09701
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
095with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
097Glass-ceramics, e.g. devitrified glass
09701Low temperature co-fired ceramic [LTCC]
H01L 2924/12032
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
10Details of semiconductor or other solid state devices to be connected
11Device type
12Passive devices, e.g. 2 terminal devices
1203Rectifying Diode
12032Schottky diode
Déposants
  • CREE, INC. [US/US]; 4600 Silicon Drive Durham, NC 27703-8475, US (AllExceptUS)
  • HUSSELL, Christopher, P. [US/US]; US (UsOnly)
  • JOO, Sung Chul [KR/US]; US (UsOnly)
  • PYLES, Robert, Shawn [US/US]; US (UsOnly)
Inventeurs
  • HUSSELL, Christopher, P.; US
  • JOO, Sung Chul; US
  • PYLES, Robert, Shawn; US
Mandataires
  • WILSON, Jeffrey, L.; Jenkins, Wilson, Taylor & Hunt, P.A. Suite 1200, University Tower 3100 Tower Boulevard Durham, NC 27707, US
Données relatives à la priorité
12/825,07528.06.2010US
Langue de publication anglais (EN)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) LIGHT EMITTING DEVICE PACKAGES WITH IMPROVED HEAT TRANSFER
(FR) BOÎTIERS DE DISPOSITIFS ÉLECTROLUMINESCENTS À TRANSFERT THERMIQUE AMÉLIORÉ
Abrégé
(EN)
Packages containing one or more light emitting devices, such as light emitting diodes (LEDs), are disclosed. In one embodiment, LED package can include a thermal element having improved solder reliability to improve heat dissipation capacity of the LED package. LED package can include a molded plastic body having one or more LEDs attached to one or more electrical elements. The LEDs can be connected to an upper surface of the thermal element. The thermal element can include a bottom surface which can extend further away in distance from a body of the LED package than a bottom surface of the electrical element. This configuration can result in an improved connection between the LED package and an external circuitry source, thereby increasing heat transfer ability of the LED package.
(FR)
L'invention concerne des boîtiers contenant un ou plusieurs dispositifs électroluminescents, tels que des diodes électroluminescentes (DEL). Dans une forme de réalisation, le boîtier de DEL peut comprendre un élément thermique qui présente une fiabilité de soudures améliorée afin d'améliorer la capacité de dissipation thermique du boîtier de DEL. Le boîtier de DEL peut comprendre un corps de plastique moulé comportant une ou plusieurs DEL fixée(s) à un ou à plusieurs élément(s) électrique(s). Les DEL peuvent être connectées à une surface supérieure de l'élément thermique. L'élément thermique peut comprendre une surface inférieure qui peut s'étendre plus loin, par rapport à un corps du boîtier de DEL, qu'une surface inférieure de l'élément électrique. Cette conception permet d'obtenir une connexion améliorée entre le boîtier de DEL et une source de circuit externe, ce qui permet d'accroître la capacité de transfert thermique du boîtier de DEL.
Également publié en tant que
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