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1. WO2011118939 - COMPOSITION DE RÉSINE PHOTODURCISSABLE ET THERMODURCISSABLE, ET RÉSERVE DE SOUDURE DU TYPE FILM SEC

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Numéro de publication WO/2011/118939
Date de publication 29.09.2011
N° de la demande internationale PCT/KR2011/001889
Date du dépôt international 18.03.2011
CIB
G03F 7/027 2006.1
GPHYSIQUE
03PHOTOGRAPHIE; CINÉMATOGRAPHIE; TECHNIQUES ANALOGUES UTILISANT D'AUTRES ONDES QUE DES ONDES OPTIQUES; ÉLECTROGRAPHIE; HOLOGRAPHIE
FPRODUCTION PAR VOIE PHOTOMÉCANIQUE DE SURFACES TEXTURÉES, p.ex. POUR L'IMPRESSION, POUR LE TRAITEMENT DE DISPOSITIFS SEMI-CONDUCTEURS; MATÉRIAUX À CET EFFET; ORIGINAUX À CET EFFET; APPAREILLAGES SPÉCIALEMENT ADAPTÉS À CET EFFET
7Production par voie photomécanique, p.ex. photolithographique, de surfaces texturées, p.ex. surfaces imprimées; Matériaux à cet effet, p.ex. comportant des photoréserves; Appareillages spécialement adaptés à cet effet
004Matériaux photosensibles
027Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p.ex. composés éthyléniques
G03F 7/028 2006.1
GPHYSIQUE
03PHOTOGRAPHIE; CINÉMATOGRAPHIE; TECHNIQUES ANALOGUES UTILISANT D'AUTRES ONDES QUE DES ONDES OPTIQUES; ÉLECTROGRAPHIE; HOLOGRAPHIE
FPRODUCTION PAR VOIE PHOTOMÉCANIQUE DE SURFACES TEXTURÉES, p.ex. POUR L'IMPRESSION, POUR LE TRAITEMENT DE DISPOSITIFS SEMI-CONDUCTEURS; MATÉRIAUX À CET EFFET; ORIGINAUX À CET EFFET; APPAREILLAGES SPÉCIALEMENT ADAPTÉS À CET EFFET
7Production par voie photomécanique, p.ex. photolithographique, de surfaces texturées, p.ex. surfaces imprimées; Matériaux à cet effet, p.ex. comportant des photoréserves; Appareillages spécialement adaptés à cet effet
004Matériaux photosensibles
027Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p.ex. composés éthyléniques
028avec des substances accroissant la photosensibilité, p.ex. photo-initiateurs
CPC
C08F 222/103
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
222Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
10Esters
1006of polyhydric alcohols or polyhydric phenols
103of trialcohols, e.g. trimethylolpropane tri(meth)acrylate
C09D 133/14
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
133Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
04Homopolymers or copolymers of esters
14of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
G03F 7/027
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
G03F 7/028
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
028with photosensitivity-increasing substances, e.g. photoinitiators
G03F 7/038
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
038Macromolecular compounds which are rendered insoluble or differentially wettable
Déposants
  • 주식회사 엘지화학 LG CHEM, LTD. [KR]/[KR] (AllExceptUS)
  • 정우재 JEONG, Woo-Jae [KR]/[KR] (UsOnly)
  • 최병주 CHOI, Byung-Ju [KR]/[KR] (UsOnly)
  • 최보윤 CHOI, Bo-Yun [KR]/[KR] (UsOnly)
  • 이광주 LEE, Kwang-Joo [KR]/[KR] (UsOnly)
  • 정민수 JEONG, Min-Su [KR]/[KR] (UsOnly)
Inventeurs
  • 정우재 JEONG, Woo-Jae
  • 최병주 CHOI, Byung-Ju
  • 최보윤 CHOI, Bo-Yun
  • 이광주 LEE, Kwang-Joo
  • 정민수 JEONG, Min-Su
Mandataires
  • 유미특허법인 YOU ME PATENT & LAW FIRM
Données relatives à la priorité
10-2010-002539722.03.2010KR
Langue de publication Coréen (ko)
Langue de dépôt coréen (KO)
États désignés
Titre
(EN) PHOTOCURABLE AND THERMOCURABLE RESIN COMPOSITION, AND DRY FILM SOLDER RESIST
(FR) COMPOSITION DE RÉSINE PHOTODURCISSABLE ET THERMODURCISSABLE, ET RÉSERVE DE SOUDURE DU TYPE FILM SEC
(KO) 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트
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Abrégé
(EN) The present invention relates to a photocurable and thermocurable resin composition that shows improved alkali developability and is capable of providing a dry film solder resist having good heat resistance and dimensional stability, and to a dry film solder resist. The resin composition may comprise: an acid-modified oligomer having a carboxyl group (-COOH) and a photocurable functional group; a photopolymerizable monomer having an epoxy acrylate group of 3 or more functions bonded to a nitrogen-containing heteroring, and a compound configured with a functional group having a carboxyl group bonded to one expoxy acrylate group or more; a thermocurable binder having a thermocurable functional group; and a photoinitiator.
(FR) Cette invention concerne une composition de résine photodurcissable et thermodurcissable qui présente une aptitude améliorée à la révélation en milieu alcalin et peut fournir une réserve de soudure du type film sec ayant une bonne résistance à la chaleur et stabilité dimensionnelle ; et une réserve de soudure du type film sec. La composition de résine selon l'invention peut comprendre : un oligomère modifié par un acide contenant un groupe carboxyle (-COOH) et un groupe fonctionnel photodurcissable ; un monomère photopolymérisable contenant un groupe époxyacrylate trifonctionnalisé ou plus lié à un hétérocycle contenant un atome d'azote, et un composé monofonctionnalisé contenant un groupe carboxyle lié à un groupe époxyacrylate ou plus ; un liant thermodurcissable portant un groupe fonctionnel thermodurcissable ; et un amorceur photochimique.
(KO) 본 발명은 보다 향상된 알칼리 현상성을 나타내면서도, 우수한 내열성 및 치수 안정성 등을 갖는 드라이 필름 솔더 레지스트의 제공을 가능케 하는 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트 에 관한 것이다. 상기 수지 조성물은 카르복시기(-COOH)와, 광경화 가능한 작용기를 갖는 산변성 올리고머; 질소 함유 헤테로 환에 3관능 이상의 에폭시 아크릴레이트기가 결합되어 있고, 하나 이상의 에폭시 아크릴레이트기에는 카르복시기를 갖는 작용기가 결합되어 있는 구조의 화합물을 포함하는 광중합성 모노머; 열경화 가능한 작용기를 갖는 열경화성 바인더; 및 광개시제를 포함할 수 있다.
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