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1. WO2011053952 - BOÎTIER DE LAMPE À DIODE ÉLECTROLUMINESCENTE DOTÉ D'UN CIRCUIT D'ATTAQUE INTÉGRAL

Numéro de publication WO/2011/053952
Date de publication 05.05.2011
N° de la demande internationale PCT/US2010/055049
Date du dépôt international 02.11.2010
CIB
F21V 21/00 2006.01
FMÉCANIQUE; ÉCLAIRAGE; CHAUFFAGE; ARMEMENT; SAUTAGE
21ÉCLAIRAGE
VCARACTÉRISTIQUES FONCTIONNELLES OU DÉTAILS FONCTIONNELS DES DISPOSITIFS OU SYSTÈMES D'ÉCLAIRAGE; COMBINAISONS STRUCTURALES DE DISPOSITIFS D'ÉCLAIRAGE AVEC D'AUTRES OBJETS, NON PRÉVUES AILLEURS
21Soutien, suspension ou fixation des dispositifs d'éclairage; Poignées
CPC
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48247
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48245the item being metallic
48247connecting the wire to a bond pad of the item
H01L 24/97
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
93Batch processes
95at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
97the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
H01L 25/167
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
16the devices being of types provided for in two or more different main groups of H01L27/00 - H01L49/00 ; and H01L51/00; , e.g. forming hybrid circuits
167comprising optoelectronic devices, e.g. LED, photodiodes
H01L 2924/09701
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
095with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
097Glass-ceramics, e.g. devitrified glass
09701Low temperature co-fired ceramic [LTCC]
H01L 2924/12041
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
10Details of semiconductor or other solid state devices to be connected
11Device type
12Passive devices, e.g. 2 terminal devices
1204Optical Diode
12041LED
Déposants
  • AKRON BRASS COMPANY [US]/[US] (AllExceptUS)
  • BARNETT, Thomas J. [US]/[US] (UsOnly)
Inventeurs
  • BARNETT, Thomas J.
Mandataires
  • FORHAN, Michael A.
Données relatives à la priorité
12/916,69801.11.2010US
61/257,29502.11.2009US
Langue de publication anglais (EN)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) LED LAMP PACKAGE WITH INTEGRAL DRIVER
(FR) BOÎTIER DE LAMPE À DIODE ÉLECTROLUMINESCENTE DOTÉ D'UN CIRCUIT D'ATTAQUE INTÉGRAL
Abrégé
(EN)
A lamp package (10) includes a leadframe (20). At least one light emitting diode (12) is mechanically and electrically coupled to the leadframe (20). At least one electronic component (14) is also mechanically and electrically coupled to the leadframe (20) and electrically coupled to the light emitting diode (12), the electronic component (14) controlling the supply of electrical power to the light emitting diode (12). At least one interconnect (16) is electrically coupled to the leadframe (20). A formed structure (26) is joined to the leadframe (20), the formed structure (26) enclosing at least a portion of the leadframe (20).
(FR)
La présente invention a trait à un boîtier de lampe (10) qui inclut une grille de connexion (20). Au moins une diode électroluminescente (12) est mécaniquement et électriquement couplée à la grille de connexion (20). Au moins un composant électronique (14) est également mécaniquement et électriquement couplé à la grille de connexion (20) et électriquement couplé à la diode électroluminescente (12), le composant électronique (14) commandant l'alimentation électrique de la diode électroluminescente (12). Au moins une interconnexion (16) est électriquement couplée à la grille de connexion (20). Une structure formée (26) est jointe à la grille de connexion (20), laquelle structure formée (26) entoure au moins une partie de la grille de connexion (20).
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