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1. WO2010127949 - COMPOSANT MINIATURE HYPERFREQUENCES POUR MONTAGE EN SURFACE

Numéro de publication WO/2010/127949
Date de publication 11.11.2010
N° de la demande internationale PCT/EP2010/055359
Date du dépôt international 22.04.2010
CIB
H01P 5/02 2006.1
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
PGUIDES D'ONDES; RÉSONATEURS, LIGNES OU AUTRES DISPOSITIFS DU TYPE GUIDE D'ONDES
5Dispositifs de couplage du type guide d'ondes
02à coefficient de couplage invariable
H01P 5/107 2006.1
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
PGUIDES D'ONDES; RÉSONATEURS, LIGNES OU AUTRES DISPOSITIFS DU TYPE GUIDE D'ONDES
5Dispositifs de couplage du type guide d'ondes
08destinés au couplage de lignes ou de dispositifs de différentes sortes
10destinés au couplage de lignes ou de dispositifs équilibrés avec des lignes ou des dispositifs déséquilibrés
107Transitions entre guides d'ondes creux triplaque
H01L 23/00 2006.1
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
23Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H05K 1/18 2006.1
HÉLECTRICITÉ
05TECHNIQUES ÉLECTRIQUES NON PRÉVUES AILLEURS
KCIRCUITS IMPRIMÉS; ENVELOPPES OU DÉTAILS DE RÉALISATION D'APPAREILS ÉLECTRIQUES; FABRICATION D'ENSEMBLES DE COMPOSANTS ÉLECTRIQUES
1Circuits imprimés
18Circuits imprimés associés structurellement à des composants électriques non imprimés
CPC
H01L 2224/04042
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
04Structure, shape, material or disposition of the bonding areas prior to the connecting process
04042Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
H01L 2224/16225
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
161Disposition
16151the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
16221the body and the item being stacked
16225the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L 2224/32245
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
321Disposition
32151the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
32221the body and the item being stacked
32245the item being metallic
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48137
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
48137the bodies being arranged next to each other, e.g. on a common substrate
H01L 2224/48247
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48245the item being metallic
48247connecting the wire to a bond pad of the item
Déposants
  • UNITED MONOLITHIC SEMICONDUCTORS S.A. [FR]/[FR] (AllExceptUS)
  • ALLEAUME, Pierre-Franck [FR]/[FR] (UsOnly)
  • TOUSSAIN, Claude [FR]/[FR] (UsOnly)
Inventeurs
  • ALLEAUME, Pierre-Franck
  • TOUSSAIN, Claude
Mandataires
  • LUCAS, Laurent
Données relatives à la priorité
090216005.05.2009FR
Langue de publication Français (fr)
Langue de dépôt français (FR)
États désignés
Titre
(EN) MINIATURE MICROWAVE COMPONENT FOR SURFACE-MOUNTING
(FR) COMPOSANT MINIATURE HYPERFREQUENCES POUR MONTAGE EN SURFACE
Abrégé
(EN) The invention relates to a miniature microwave component, comprising: an MMIC microwave chip (100) encapsulated in an individual housing (222) for surface-mounting capable of operating at a frequency F0 much higher than 45 GHz; at least one contactless microwave access (124), by electromagnetic coupling, ensuring the transmission of coupling signals at a operating frequency F0. The component comprises a passive multilayer integrated circuit (220) having metallized layers and layers made of a dielectric material (140, 142, 144), a top surface (224), a metallized bottom surface (225), the metallized bottom surface comprising, on the side of the contactless microwave access (124), an opening (236) in the metallization through which electromagnetic waves can pass for coupling by the contactless microwave access and, between two layers of dielectric material, a metallized layer (146) having at least one electromagnetic coupling electric conductor (148) connected to the electronic components of the chip (100), said coupling electric conductor (148) being located next to the contactless microwave access (124) in order to ensure the transmission of microwave signals by electromagnetic coupling at the operating frequency F0. The invention can be used in automobile radars and high-bandwidth communications.
(FR) L'invention concerne un composant miniature hyperfréquences comportant : - une puce hyperfréquence MMIC (100) encapsulée dans un boîtier individuel (222) pour montage en surface capable de fonctionner à une fréquence F0 très supérieures à 45GHz; - au moins un accès hyperfréquence sans contact (124), par couplage électromagnétique assurant la transmission de signaux de couplage à une fréquence de travail F0, Le composant comporte un circuit intégré multicouches passif (220) ayant des couches métallisées et des couches en matériau diélectrique (140, 142, 144), une face supérieure (224), une face inférieure (225) métallisée, la face inférieure métallisée comportant, du côté de l'accès hyperfréquence sans contact (124), une ouverture (236) dans la métallisation pour le passage des ondes électromagnétiques de couplage par l'accès hyperfréquence sans contact et, entre deux couches de matériau diélectrique, une couche métallisée (146) ayant au moins un conducteur électrique (148) de couplage électromagnétique connecté aux éléments électroniques de la puce (100), ledit conducteur électrique de couplage (148) étant situé au niveau de l'accès hyperfréquence sans contact (124) pour assurer la transmission de signaux hyperfréquences par couplage électromagnétique à la fréquence de travail F0. Applications : radars automobiles, communications à haut débit.
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