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1. WO2009079516 - DISSIPATION THERMIQUE RÉTICULÉE

Note: Texte fondé sur des processus automatiques de reconnaissance optique de caractères. Seule la version PDF a une valeur juridique

[ EN ]

CLAIMS

What is claimed is:

1. An apparatus comprising:
a substrate;
two or more microelectronic components coupled to the substrate; wherein the two or more microelectronic components are located to extend substantially
perpendicular to the substrate; and
a heat dissipation device comprising a fin plate, wherein the fin plate is coupled to the two or more microelectronic components, and wherein the fin plate is located to extend substantially perpendicular to the substrate between the two or more
microelectronic components.

2. The apparatus of claim 1 , wherein the two or more microelectronic components comprise an electronic stack, and wherein the fin plate comprises a concave edge
located adjacent the substrate and a convex edge extending outside of the electronic stack.

3. The apparatus of claim 1, wherein the two or more microelectronic components comprise an electronic stack comprising a top surface and a bottom surface, and
wherein the fin plate comprises a concave edge located adjacent the substrate and a convex edge extending outside of the electronic stack, and wherein the heat dissipation device comprises one or more end fin plates with at least one fin plate located adjacent the top surface to the electronic stack and positioned non-parallel with respect to the top surface to the electronic stack.

4. The apparatus of claim 1, further comprising:
a second substrate coupled to the two or more microelectronic components and located to position the two or more microelectronic components between the substrate and the second substrate;
wherein the two or more microelectronic components comprise an electronic stack; and
wherein the fin plate comprises:
a concave edge located adjacent the substrate,
a second concave edge located adjacent the second substrate, and
a convex edge extending outside of the electronic stack.

5. The apparatus of claim 1, further comprising:
a second substrate coupled to the two or more microelectronic components and located to position the two or more microelectronic components between the substrate and the second substrate;
wherein the two or more microelectronic components comprise an electronic stack comprising a top surface and a bottom surface; and
wherein the fin plate comprises:
a concave edge located adjacent the substrate,
a second concave edge located adjacent the second substrate, and
a convex edge extending outside of the electronic stack; and wherein the heat dissipation device comprises one or more end fin plates with at least one fin plate located adjacent the top surface to the electronic stack and positioned non-parallel with respect to the top surface to the electronic stack.

6. The apparatus of claim 1 , wherein the two or more microelectronic components comprise an electronic stack comprising a top surface and a bottom surface, and wherein the heat dissipation device comprises one or more end fin plates with at least one fin plate located adjacent the top surface to the electronic stack and positioned non-parallel with respect to the top surface to the electronic stack.

7. The apparatus of claim 1 , wherein the two or more microelectronic components comprise an electronic stack, and wherein the fin plate comprises a substantially planar extension surface extending outside of the electronic stack and a bearing surface extending from the extension surface, wherein the bearing surface is capable of being thermally coupled to at least one of the two or more microelectronic components.

8. The apparatus of claim 1 , wherein the microelectronic component comprises an integrated circuit coupled to a package.

9. The apparatus of claim 1 , further comprising a thermally conductive material located between the heat dissipation device and the microelectronic component.

10. An apparatus comprising:
a substrate;

two or more microelectronic components coupled to the substrate; wherein the two or more microelectronic components are located to extend substantially perpendicular to the substrate; and
a heat dissipation device comprising a fin plate, wherein the fin plate is coupled to the two or more microelectronic components, and wherein the fin plate is located to extend substantially perpendicular to the substrate between the two or more microelectronic components;
a bus coupled to the microelectronic component; and
a memory device coupled to the bus.

11. The apparatus of claim 10, wherein the two or more microelectronic components comprise an electronic stack, and wherein the fin plate comprises a concave edge located adjacent the substrate and a convex edge extending outside of the electronic stack.

12. The apparatus of claim 10, wherein the two or more microelectronic components comprise an electronic stack comprising a top surface and a bottom surface, and wherein the fin plate comprises a concave edge located adjacent the substrate and a convex edge extending outside of the electronic stack, and wherein the heat dissipation device comprises one or more end fin plates with at least one fin plate located adjacent the top surface to the electronic stack and positioned non-parallel with respect to the top surface to the electronic stack.

13. The apparatus of claim 10, further comprising: a second substrate coupled to the two or more microelectronic components and located to position the two or more microelectronic components between the substrate and the second substrate;
wherein the two or more microelectronic components comprise an electronic stack; and
wherein the fin plate comprises:
a concave edge located adjacent the substrate,
a second concave edge located adjacent the second substrate, and
a convex edge extending outside of the electronic stack.

14. The apparatus of claim 10, further comprising:
a second substrate coupled to the two or more microelectronic components and located to position the two or more microelectronic components between the substrate and the second substrate;
wherein the two or more microelectronic components comprise an electronic stack comprising a top surface and a bottom surface; and
wherein the fin plate comprises:
a concave edge located adjacent the substrate,
a second concave edge located adjacent the second substrate, and
a convex edge extending outside of the electronic stack; and
wherein the heat dissipation device comprises one or more end fin plates with at least one fin plate located adjacent the top surface to the electronic stack and positioned non-parallel with respect to the top surface to the electronic stack.

15. The apparatus of claim 10, wherein the two or more microelectronic components comprise an electronic stack comprising a top surface and a bottom surface, and wherein the heat dissipation device comprises one or more end fin plates with at least one fin plate located adjacent the top surface to the electronic stack and positioned non-parallel with respect to the top surface to the electronic stack.

16. The apparatus of claim 10, wherein the two or more microelectronic components comprise an electronic stack, and wherein the fin plate comprises a substantially planar extension surface extending outside of the electronic stack and a bearing surface extending from the extension surface, wherein the bearing surface is capable of being thermally coupled to at least one of the two or more microelectronic components.

17. The apparatus of claim 1 , wherein the microelectronic component comprises an integrated circuit coupled to a package.

18. The apparatus of claim 1 , further comprising a thermally conductive material located between the heat dissipation device and the microelectronic component.

19. A method comprising:
coupling two or more microelectronic components substantially perpendicular to a substrate; and
coupling a heat dissipation device comprising a fin plate to the two or more microelectronic components, and wherein the fin plate is located to extend substantially perpendicular to the substrate between the two or more microelectronic components.

20. The method of claim 19, wherein the two or more microelectronic components comprise an electronic stack, and wherein said coupling the heat dissipation device comprises locating a concave edge of the fin plate adjacent the substrate and locating a convex edge of the fin plate to extend outside of the electronic stack.

21. The method of claim 19, further comprising:
coupling a second substrate to the two or more microelectronic components to position the two or more microelectronic components between the substrate and the second substrate, wherein the two or more microelectronic components comprise an electronic stack; and
wherein said coupling the heat dissipation device comprises locating a concave edge of the fin plate adjacent the substrate, locating a second concave edge of the fin plate adjacent the second substrate, and locating a convex edge of the fin plate to extend outside of the electronic stack.