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1. WO2007143134 - Module de camÉra À boîtier de lentille prÉmoulÉ et procÉdÉ de fabrication

Numéro de publication WO/2007/143134
Date de publication 13.12.2007
N° de la demande internationale PCT/US2007/013014
Date du dépôt international 31.05.2007
CIB
H01J 5/02 2006.01
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
JTUBES À DÉCHARGE ÉLECTRIQUE OU LAMPES À DÉCHARGE ÉLECTRIQUE
5Détails des enceintes ou des conducteurs de traversée, communs à au moins deux types de base de tubes ou lampes à décharge
02Enceintes; Récipients; Blindages associés; Vannes à vide
CPC
G03B 17/02
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
17Details of cameras or camera bodies; Accessories therefor
02Bodies
H01L 2224/05554
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
04Structure, shape, material or disposition of the bonding areas prior to the connecting process
05of an individual bonding area
0554External layer
0555Shape
05552in top view
05554being square
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48464
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
484Connecting portions
48463the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
48464the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
H01L 2224/49175
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
49of a plurality of wire connectors
491Disposition
4912Layout
49175Parallel arrangements
H04N 5/2257
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
225Television cameras ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
2257Mechanical and electrical details of cameras or camera modules for embedding in other devices
Déposants
  • FLEXTRONICS AP LLC [US/US]; 305 Interlocken Parkway Broomfield, CO 80021, US (AllExceptUS)
  • SHANGGUAN, Dongkai [US/US]; US (UsOnly)
  • TAM, Samuel, Waising [US/US]; US (UsOnly)
Inventeurs
  • SHANGGUAN, Dongkai; US
  • TAM, Samuel, Waising; US
Mandataires
  • HENNEMAN, Jr., Larry, E.; Henneman & Associates, PLC 714 W. Michigan Avenue Three Rivers, MI 49093, US
Données relatives à la priorité
11/444,27731.05.2006US
Langue de publication anglais (EN)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) CAMERA MODULE WITH PREMOLDED LENS HOUSING AND METHOD OF MANUFACTURE
(FR) Module de camÉra À boîtier de lentille prÉmoulÉ et procÉdÉ de fabrication
Abrégé
(EN)
A novel digital camera module includes an image capture device, a circuit substrate, a lens unit and a housing that is mounted to the circuit substrate before the image capture device is mounted to the circuit substrate. In one particular embodiment, the housing is formed onto the circuit substrate via molding. The housing includes a bore to receive the lens unit, with the diameter of the bore being larger than the diagonal of the image capture device such that image capture device can be mounted to the circuit substrate through the bore. In another particular embodiment, the circuit substrate includes an aperture so as to facilitate the flip-chip bonding of the image capture device. The order in which the image capture device and the housing are coupled to the circuit substrate helps prevent damage to the image capture device during the mounting of the housing to the circuit substrate.
(FR)
L'invention concerne un nouveau module de caméra numérique qui comprend un dispositif de saisie d'image, un substrat de circuit, une unité de lentille et un boîtier monté sur le substrat de circuit avant que le dispositif de saisie d'image soit monté sur le substrat de circuit. Dans un mode de réalisation particulier, le boîtier est formé sur le substrat de circuit par moulage. Le boîtier comprend un alésage qui reçoit l'unité de lentille, le diamètre de l'alésage étant plus grand que la diagonale du dispositif de saisie d'image de telle sorte que le dispositif de saisie d'image puisse être monté sur le substrat de circuit à travers l'alésage. Dans un autre mode de réalisation particulier, le substrat de circuit comprend une ouverture qui permet de faciliter la liaison du dispositif de saisie d'image par puce posée à plat. L'ordre dans lequel le dispositif de saisie d'image et le boîtier sont accouplés au substrat de circuit permet d'éviter d'endommager le dispositif de saisie d'image pendant le montage du boîtier sur le substrat de circuit.
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