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1. WO2007141686 - Puce À semiconducteur, TRANSPONDEuR et MÉTHODe de fabrication d'un TRANSPONDEuR

Numéro de publication WO/2007/141686
Date de publication 13.12.2007
N° de la demande internationale PCT/IB2007/051884
Date du dépôt international 16.05.2007
CIB
G06K 19/077 2006.01
GPHYSIQUE
06CALCUL; COMPTAGE
KRECONNAISSANCE DES DONNÉES; PRÉSENTATION DES DONNÉES; SUPPORTS D'ENREGISTREMENT; MANIPULATION DES SUPPORTS D'ENREGISTREMENT
19Supports d'enregistrement pour utilisation avec des machines et avec au moins une partie prévue pour supporter des marques numériques
06caractérisés par le genre de marque numérique, p.ex. forme, nature, code
067Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p.ex. cartes d'identité ou cartes de crédit
07avec des puces à circuit intégré
077Détails de structure, p.ex. montage de circuits dans le support
CPC
G06K 19/07749
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
07749the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
G06K 19/07756
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
07749the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
0775arrangements for connecting the integrated circuit to the antenna
07756the connection being non-galvanic, e.g. capacitive
H01L 2223/6677
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2223Details relating to semiconductor or other solid state devices covered by the group H01L23/00
58Structural electrical arrangements for semiconductor devices not otherwise provided for
64Impedance arrangements
66High-frequency adaptations
6661for passive devices
6677for antenna, e.g. antenna included within housing of semiconductor device
H01L 2224/0401
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
04Structure, shape, material or disposition of the bonding areas prior to the connecting process
0401Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
H01L 2224/13013
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
12Structure, shape, material or disposition of the bump connectors prior to the connecting process
13of an individual bump connector
13001Core members of the bump connector
1301Shape
13012in top view
13013being rectangular or square
H01L 2224/13144
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
12Structure, shape, material or disposition of the bump connectors prior to the connecting process
13of an individual bump connector
13001Core members of the bump connector
13099Material
131with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
13138the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
13144Gold [Au] as principal constituent
Déposants
  • NXP B.V.; High Tech Campus 60 NL-5656 AG Heindhoven, NL (AllExceptUS)
  • SCHERABON, Christian [AT/AT]; AT (UsOnly)
  • SALFELNER, Anton [AT/AT]; AT (UsOnly)
  • STEINBAUER, Wolfgang [AT/AT]; AT (UsOnly)
  • SCHOBER, Joachim [AT/AT]; AT (UsOnly)
Inventeurs
  • SCHERABON, Christian; AT
  • SALFELNER, Anton; AT
  • STEINBAUER, Wolfgang; AT
  • SCHOBER, Joachim; AT
Mandataires
  • RÖGGLA, Harald; NXP Semiconductors Austria GmbH Intellectual Property Department Gutheil-Schoder-Gasse 8-12 A-1102 Vienna, AT
Données relatives à la priorité
06115080.107.06.2006EP
Langue de publication anglais (EN)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) SEMICONDUCTOR CHIP, TRANSPONDER AND METHOD OF MANUFACTURING A TRANSPONDER
(FR) Puce À semiconducteur, TRANSPONDEuR et MÉTHODe de fabrication d'un TRANSPONDEuR
Abrégé
(EN)
A semiconductor chip (1, 91) for a transponder (3, 93) comprises a chip substrate (4) with a surface (5), chip terminals (6, 7) arranged on the surface (5), and a passivation layer (22) covering the surface (5) and completely covering the chip terminals (6, 7), so that an antenna (2, 30) with antenna terminals (24, 25) can be attached to the chip (1, 91) above the chip terminals (6, 7), so that the chip terminals (6, 7), the passivation layer (22) and the antenna terminal (24, 25) form first capacitors.
(FR)
L'invention concerne une puce à semiconducteur (1, 91) pour un transpondeur (3, 93) qui comprend un substrat pour la puce (4) ayant une surface (5), des sorties de la puce (6, 7) disposées sur la surface (5), et une couche de passivation (22) couvrant la surface (5) et recouvrant complètement les sorties de la puce (6, 7), de telle sorte qu'une antenne (2, 30) ayant des bornes d'antenne (24, 25) peut être fixée à la puce (1, 91) par-dessus les sorties de la puce (6, 7), de telle sorte que les sorties de la puce (6, 7), la couche de passivation (22) et la borne d'antenne (24, 25) constituent des condensateurs.
Également publié en tant que
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