Traitement en cours

Veuillez attendre...

Paramétrages

Paramétrages

1. WO2007139781 - DISPOSITIF D'ÉCLAIRAGE

Numéro de publication WO/2007/139781
Date de publication 06.12.2007
N° de la demande internationale PCT/US2007/012159
Date du dépôt international 22.05.2007
Demande présentée en vertu du Chapitre 2 27.05.2008
CIB
F21V 7/00 2006.01
FMÉCANIQUE; ÉCLAIRAGE; CHAUFFAGE; ARMEMENT; SAUTAGE
21ÉCLAIRAGE
VCARACTÉRISTIQUES FONCTIONNELLES OU DÉTAILS FONCTIONNELS DES DISPOSITIFS OU SYSTÈMES D'ÉCLAIRAGE; COMBINAISONS STRUCTURALES DE DISPOSITIFS D'ÉCLAIRAGE AVEC D'AUTRES OBJETS, NON PRÉVUES AILLEURS
7Réflecteurs pour sources lumineuses
CPC
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48247
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48245the item being metallic
48247connecting the wire to a bond pad of the item
H01L 25/0753
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
075the devices being of a type provided for in group H01L33/00
0753the devices being arranged next to each other
H01L 33/50
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
50Wavelength conversion elements
H01L 33/60
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
58Optical field-shaping elements
60Reflective elements
Y10S 362/80
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
362Illumination
80Light emitting diode
Déposants
  • CREE LED LIGHTING SOLUTIONS, INC. [US/US]; 4600 Silicon Drive Durham, NC 27703, US (AllExceptUS)
  • NEGLEY, Gerald, H.; US (UsOnly)
  • VAN DE VEN, Antony, Paul [AU/CN]; CN (UsOnly)
Inventeurs
  • NEGLEY, Gerald, H.; US
  • VAN DE VEN, Antony, Paul; CN
Mandataires
  • BROWN, Kevin, C. ; P.O. Box 7068 Syracuse, New York 13261, US
Données relatives à la priorité
60/802,70923.05.2006US
60/808,70226.05.2006US
Langue de publication anglais (EN)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) LIGHTING DEVICE
(FR) DISPOSITIF D'ÉCLAIRAGE
Abrégé
(EN)
A first lighting device comprises at least one plural cavity element and a plurality of solid state light emitters. A second lighting device comprises at least one plural cavity element, a plurality of solid state light emitters and at least one encapsulant region, at least a portion of the plural cavity element being surrounded by the encapsulant region. Each plural cavity element has at least two optical cavities. Each optical cavity comprises a concave region in the plural cavity element. At least one solid state light emitter is present in each of at least two of the optical cavities.
(FR)
Selon l'invention, un premier dispositif d'éclairage comprend au moins un élément à plusieurs cavités et une pluralité d'émetteurs de lumière à semi-conducteur. Un second dispositif d'éclairage comprend au moins un élément à plusieurs cavités, une pluralité d'émetteurs de lumière à semi-conducteur et au moins une zone d'encapsulation, au moins une partie de l'élément à plusieurs cavités étant entourée par la zone d'encapsulation. Chaque élément à plusieurs cavités présente au moins deux cavités optiques. Chaque cavité optique comprend une zone concave de l'élément à plusieurs cavité. Au moins un émetteur de lumière à semi-conducteur est présent dans chacune des cavités optiques.
Également publié en tant que
KR1020087031113
Dernières données bibliographiques dont dispose le Bureau international