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1. WO2006107550 - STRUCTURE BARRIERE ET DISPOSITIF DE BUSES POUR OUTILS DE TRAITEMENT DE PIECES MICROELECTRONIQUES PAR FLUIDES

Numéro de publication WO/2006/107550
Date de publication 12.10.2006
N° de la demande internationale PCT/US2006/009353
Date du dépôt international 15.03.2006
CIB
H01L 21/00 2006.01
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
21Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de dispositifs à semi-conducteurs ou de dispositifs à l'état solide, ou bien de leurs parties constitutives
CPC
H01L 21/67017
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
H01L 21/67051
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
67028for cleaning followed by drying, rinsing, stripping, blasting or the like
6704for wet cleaning or washing
67051using mainly spraying means, e.g. nozzles
H01L 21/6708
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
67063for etching
67075for wet etching
6708using mainly spraying means, e.g. nozzles
Y10S 134/902
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
134Cleaning and liquid contact with solids
902Semiconductor wafer
Y10T 137/85938
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
137Fluid handling
8593Systems
85938Non-valved flow dividers
Déposants
  • FSI INTERNATIONAL, INC. [US]/[US] (AllExceptUS)
  • COLLINS, Jimmy, D. [US]/[US] (UsOnly)
  • COOPER, Samuel, A. [US]/[US] (UsOnly)
  • EPPES, James, M. [US]/[US] (UsOnly)
  • ROSE, Alan, D. [US]/[US] (UsOnly)
  • MEKIAS, Kader [US]/[US] (UsOnly)
Inventeurs
  • COLLINS, Jimmy, D.
  • COOPER, Samuel, A.
  • EPPES, James, M.
  • ROSE, Alan, D.
  • MEKIAS, Kader
Mandataires
  • PARINS, Paul, J.
Données relatives à la priorité
60/667,26301.04.2005US
60/667,36901.04.2005US
Langue de publication anglais (EN)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) BARRIER STRUCTURE AND NOZZLE DEVICE FOR USE IN TOOLS USED TO PROCESS MICROELECTRONIC WORKPIECES WITH ONE OR MORE TREATMENT FLUIDS
(FR) STRUCTURE BARRIERE ET DISPOSITIF DE BUSES POUR OUTILS DE TRAITEMENT DE PIECES MICROELECTRONIQUES PAR FLUIDES
Abrégé
(EN)
Apparatuses, and related methods, for processing a workpiece that include a particular barrier structure that can overlie and cover a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular movable member that can be positioned over and moved relative to a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular ceiling structure that can overlie a processing chamber. Nozzle devices, and related methods, that include a particular annular body. Nozzle devices, and related methods, that include a particular first, second, and third nozzle structure.
(FR)
Appareils, et procédés correspondants, pour traiter une pièce, incluant une structure barrière particulière pouvant recouvrir en tout ou partie une pièce. Appareils, et procédés correspondants, pour traiter une pièce, avec un élément mobile particulier positionnable et mobile par rapport à une pièce et au-dessus d'elle. Appareils, et procédés correspondants, pour traiter une pièce, avec une structure plafond particulière pouvant recouvrir partiellement une chambre de traitement. Dispositifs de buses, et procédés correspondants, avec un corps annulaire particulier. Dispositifs de buses, et procédés correspondants, avec trois structures particulières de buses.
Également publié en tant que
EP6738416
Dernières données bibliographiques dont dispose le Bureau international