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1. WO2005020656 - PROCEDE DE VERIFICATION DE COMPOSANTS

Numéro de publication WO/2005/020656
Date de publication 03.03.2005
N° de la demande internationale PCT/JP2004/012453
Date du dépôt international 24.08.2004
CIB
H05K 13/00 2006.01
HÉLECTRICITÉ
05TECHNIQUES ÉLECTRIQUES NON PRÉVUES AILLEURS
KCIRCUITS IMPRIMÉS; ENVELOPPES OU DÉTAILS DE RÉALISATION D'APPAREILS ÉLECTRIQUES; FABRICATION D'ENSEMBLES DE COMPOSANTS ÉLECTRIQUES
13Appareils ou procédés spécialement adaptés à la fabrication ou l'ajustage d'ensembles de composants électriques
H05K 13/04 2006.01
HÉLECTRICITÉ
05TECHNIQUES ÉLECTRIQUES NON PRÉVUES AILLEURS
KCIRCUITS IMPRIMÉS; ENVELOPPES OU DÉTAILS DE RÉALISATION D'APPAREILS ÉLECTRIQUES; FABRICATION D'ENSEMBLES DE COMPOSANTS ÉLECTRIQUES
13Appareils ou procédés spécialement adaptés à la fabrication ou l'ajustage d'ensembles de composants électriques
04Montage de composants
CPC
H05K 13/084
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
08Monitoring manufacture of assemblages
084Product tracking, e.g. of substrates during the manufacturing process; Component traceability
Y10T 29/49004
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
49Method of mechanical manufacture
49002Electrical device making
49004including measuring or testing of device or component part
Y10T 29/4913
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
49Method of mechanical manufacture
49002Electrical device making
49117Conductor or circuit manufacturing
49124On flat or curved insulated base, e.g., printed circuit, etc.
4913Assembling to base an electrical component, e.g., capacitor, etc.
Y10T 29/49133
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
49Method of mechanical manufacture
49002Electrical device making
49117Conductor or circuit manufacturing
49124On flat or curved insulated base, e.g., printed circuit, etc.
4913Assembling to base an electrical component, e.g., capacitor, etc.
49133with component orienting
Y10T 29/53052
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
53Means to assemble or disassemble
53039with control means energized in response to activator stimulated by condition sensor
53048Multiple station assembly or disassembly apparatus
53052including position sensor
Y10T 29/53174
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
53Means to assemble or disassemble
5313Means to assemble electrical device
53174Means to fasten electrical component to wiring board, base, or substrate
Déposants
  • MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. [JP]/[JP] (AllExceptUS)
  • MAENISHI, Yasuhiro (UsOnly)
  • KONISHI, Chikashi (UsOnly)
  • YOSHIDA, Ikuo (UsOnly)
  • NISHIDA, Hiroyoshi (UsOnly)
  • MATSUMOTO, Masaya (UsOnly)
  • YAMASAKI, Akihito (UsOnly)
  • YAMAZAKI, Takuya (UsOnly)
Inventeurs
  • MAENISHI, Yasuhiro
  • KONISHI, Chikashi
  • YOSHIDA, Ikuo
  • NISHIDA, Hiroyoshi
  • MATSUMOTO, Masaya
  • YAMASAKI, Akihito
  • YAMAZAKI, Takuya
Mandataires
  • NII, Hiromori
Données relatives à la priorité
2003-30183826.08.2003JP
2003-37837307.11.2003JP
Langue de publication anglais (EN)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) COMPONENT VERIFICATION METHOD
(FR) PROCEDE DE VERIFICATION DE COMPOSANTS
Abrégé
(EN)
A component verification method for a mounter (100) that is capable of performing component verification with less labor, is comprised of: a position specification step (S12A) of specifying a placement position in the mounter (100) where a component tape is placed; a read step (S13) of reading component information from an IC tag (426b) that is attached to the component tape or a reel (426); and a verification step (S14) of verifying the component information and the placement position against component arrangement data that indicates components that should be mounted onto the board as well a position where the component tape should be placed.
(FR)
L'invention concerne un procédé de vérification de composants pour dispositif (100) de montage permettant de procéder plus facilement à la vérification de composants, et comprenant une étape (S12A) de spécification de position permettant de spécifier une position de placement sur le dispositif (100) de montage sur laquelle est placé un ruban de composant, une étape (S13) de lecture d'informations des composants d'une étiquette IC (426b) rattachée au ruban de composant ou à une bobine (426), et une étape (S14) de vérification des informations des composants et de la position de placement par rapport à des données de disposition des composants indiquant les composants devant être montés sur la carte, ainsi que la position sur laquelle le ruban de composant doit être placé.
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