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1. WO2005009094 - MODULE ELECTRONIQUE, ET SON PROCEDE DE PRODUCTION

Numéro de publication WO/2005/009094
Date de publication 27.01.2005
N° de la demande internationale PCT/DE2004/001145
Date du dépôt international 04.06.2004
Demande présentée en vertu du Chapitre 2 18.03.2005
CIB
H05K 1/00 2006.01
HÉLECTRICITÉ
05TECHNIQUES ÉLECTRIQUES NON PRÉVUES AILLEURS
KCIRCUITS IMPRIMÉS; ENVELOPPES OU DÉTAILS DE RÉALISATION D'APPAREILS ÉLECTRIQUES; FABRICATION D'ENSEMBLES DE COMPOSANTS ÉLECTRIQUES
1Circuits imprimés
H05K 1/18 2006.01
HÉLECTRICITÉ
05TECHNIQUES ÉLECTRIQUES NON PRÉVUES AILLEURS
KCIRCUITS IMPRIMÉS; ENVELOPPES OU DÉTAILS DE RÉALISATION D'APPAREILS ÉLECTRIQUES; FABRICATION D'ENSEMBLES DE COMPOSANTS ÉLECTRIQUES
1Circuits imprimés
18Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 3/10 2006.01
HÉLECTRICITÉ
05TECHNIQUES ÉLECTRIQUES NON PRÉVUES AILLEURS
KCIRCUITS IMPRIMÉS; ENVELOPPES OU DÉTAILS DE RÉALISATION D'APPAREILS ÉLECTRIQUES; FABRICATION D'ENSEMBLES DE COMPOSANTS ÉLECTRIQUES
3Appareils ou procédés pour la fabrication de circuits imprimés
10dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
H05K 3/46 2006.01
HÉLECTRICITÉ
05TECHNIQUES ÉLECTRIQUES NON PRÉVUES AILLEURS
KCIRCUITS IMPRIMÉS; ENVELOPPES OU DÉTAILS DE RÉALISATION D'APPAREILS ÉLECTRIQUES; FABRICATION D'ENSEMBLES DE COMPOSANTS ÉLECTRIQUES
3Appareils ou procédés pour la fabrication de circuits imprimés
46Fabrication de circuits multi-couches
CPC
H01L 2224/16227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
161Disposition
16151the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
16221the body and the item being stacked
16225the item being non-metallic, e.g. insulating substrate with or without metallisation
16227the bump connector connecting to a bond pad of the item
H01L 2224/16235
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
161Disposition
16151the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
16221the body and the item being stacked
16225the item being non-metallic, e.g. insulating substrate with or without metallisation
16235the bump connector connecting to a via metallisation of the item
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
H01L 2224/73207
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
732Location after the connecting process
73201on the same surface
73207Bump and wire connectors
H01L 2225/0651
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2225Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
04the devices not having separate containers
065the devices being of a type provided for in group H01L27/00
06503Stacked arrangements of devices
0651Wire or wire-like electrical connections from device to substrate
H01L 2225/06517
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2225Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
04the devices not having separate containers
065the devices being of a type provided for in group H01L27/00
06503Stacked arrangements of devices
06517Bump or bump-like direct electrical connections from device to substrate
Déposants
  • INFINEON TECHNOLOGIES AG [DE/DE]; St.-Martin-Strasse 53 81669 München, DE (AllExceptUS)
  • BAUER, Michael [DE/DE]; DE (UsOnly)
  • EURSKENS, Wolfram [DE/DE]; DE (UsOnly)
  • KERLER, Rudolf [DE/DE]; DE (UsOnly)
  • PAPE, Heinz [DE/DE]; DE (UsOnly)
  • STROBEL, Peter [DE/DE]; DE (UsOnly)
  • STÖCKL, Stephan [DE/DE]; DE (UsOnly)
Inventeurs
  • BAUER, Michael; DE
  • EURSKENS, Wolfram; DE
  • KERLER, Rudolf; DE
  • PAPE, Heinz; DE
  • STROBEL, Peter; DE
  • STÖCKL, Stephan; DE
Mandataires
  • SCHÄFER, Horst; Kanzlei Schweiger & Partner Karl-Theodor-Strasse 69 80803 München, DE
Données relatives à la priorité
103 29 143.127.06.2003DE
Langue de publication allemand (DE)
Langue de dépôt allemand (DE)
États désignés
Titre
(DE) ELEKTRONISCHES MODUL UND VERFAHREN ZUR HERSTELLUNG DESSELBEN
(EN) ELECTRONIC MODULE AND METHOD FOR THE PRODUCTION THEREOF
(FR) MODULE ELECTRONIQUE, ET SON PROCEDE DE PRODUCTION
Abrégé
(DE)
Die vorliegende Erfindung betrifft ein elektronisches Modul (25) und ein Verfahren zur Herstellung desselben. Das elektronische Modul (25) weist mehrere Bauelemente (1-6) auf einem Verdrahtungsblock (9) angeordnet auf. Der Verdrahtungsblock (9) weist mehrere Außenseiten (11-14) auf und besitzt in seinem Volumen Leitungen (15), die Kontaktanschlussflächen (10) auf den Außenseiten (11-14) untereinander verbinden. Die Kontaktanschlussflächen (10) sind mit Bauelementanschlüssen (7) der Bauelemente (1-6) elektrisch verbunden.
(EN)
The invention relates to an electronic module (25) and to a method for the production thereof. The electronic module (25) has several components (1-6) arranged on a wiring block (9). The wiring block (9) has several outer sides (11-14), the volume thereof having lines (15) connecting to one another the contact terminal surfaces (10) on the outer sides (11-14). The contact terminal surfaces (10) are electrically connected to the terminals (7) of the components (1-6).
(FR)
L'invention concerne un module électronique (25) et son procédé de production. Ce module électronique (25) comporte plusieurs composants (1-6) sur un bloc de câblage (9). Ce bloc de câblage (9) présente plusieurs faces extérieures (11-14) et comporte en son sein des lignes (15) qui relient entre elles des surfaces de raccordement par contact (10) sur lesdites faces extérieures (11-14). Les surfaces de raccordement par contact (10) sont reliées électriquement avec des raccords (7) des composants (1-6).
Également publié en tant que
US2006250781
Dernières données bibliographiques dont dispose le Bureau international