Traitement en cours

Veuillez attendre...

Paramétrages

Paramétrages

1. WO2005005501 - BANDE DE DECOUPAGE EN DES DE TRANCHE DETACHABLES SOUS L'EFFET DE LA CHALEUR

Numéro de publication WO/2005/005501
Date de publication 20.01.2005
N° de la demande internationale PCT/US2003/036559
Date du dépôt international 17.11.2003
CIB
C09J 4/06 2006.01
CCHIMIE; MÉTALLURGIE
09COLORANTS; PEINTURES; PRODUITS À POLIR; RÉSINES NATURELLES; ADHÉSIFS; COMPOSITIONS NON PRÉVUES AILLEURS; UTILISATIONS DE SUBSTANCES, NON PRÉVUES AILLEURS
JADHÉSIFS; ASPECTS NON MÉCANIQUES DES PROCÉDÉS DE COLLAGE EN GÉNÉRAL; PROCÉDÉS DE COLLAGE NON PRÉVUS AILLEURS; EMPLOI DE MATÉRIAUX COMME ADHÉSIFS
4Adhésifs à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
06en combinaison avec un composé macromoléculaire autre qu'un polymère non saturé des groupes C09J159/-C09J187/144
CPC
C08F 8/30
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
8Chemical modification by after-treatment
30Introducing nitrogen atoms or nitrogen-containing groups
C08F 8/42
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
8Chemical modification by after-treatment
42Introducing metal atoms or metal-containing groups
C08K 5/0025
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
0008Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
0025Crosslinking or vulcanising agents; including accelerators
C09J 11/06
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
11Features of adhesives not provided for in group C09J9/00, e.g. additives
02Non-macromolecular additives
06organic
C09J 2205/102
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
2205Other features
10of adhesive tapes; Production process thereof
102additives as essential feature of the adhesive layer, the additive itself being indicated with the corresponding code of C08K
C09J 4/06
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
4Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
06Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond; in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
Déposants
  • ADHESIVES RESEARCH, INC. [US/US]; 400 Seaks Run Road Glen Rock, PA 17327, US (AllExceptUS)
  • XIA, Wilson, Z. [SG/US]; US (UsOnly)
  • HARIHARAN, Deepak [US/US]; US (UsOnly)
  • BARTON, Joel [US/US]; US (UsOnly)
Inventeurs
  • XIA, Wilson, Z.; US
  • HARIHARAN, Deepak; US
  • BARTON, Joel; US
Mandataires
  • HELLWEGE, James, W.; Birch, Stewart, Kolasch & Birch, LLP P.O. Box 747 Falls Church, VA 22040-0747, US
Données relatives à la priorité
60/479,17918.06.2003US
Langue de publication anglais (EN)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) HEAT RELEASABLE WAFER DICING TAPE
(FR) BANDE DE DECOUPAGE EN DES DE TRANCHE DETACHABLES SOUS L'EFFET DE LA CHALEUR
Abrégé
(EN)
A thermocurable pressure sensitive adhesive composition is provided comprised of at least one pressure sensitive adhesive, at least one multifunctional monomer or oligomer, at least one free radical initiator, and optionally a crosslinking agent. The pressure sensitive adhesive composition of the present invention may be used with advantage in the production of a semiconductor chip, wherein a wafer chip is attached to the pressure sensitive adhesive layer during the chip manufacturing process during which a diced chip is produced. The adhesive composition may be thermocured once the diced chip has been processed to permit ease of removal of the diced chip due to loss of adhesion by the adhesive composition as a result of being thermocured.
(FR)
L'invention concerne une composition adhésive sensible à la pression et thermodurcissable, se composant d'au moins un adhésif sensible à la pression, d'au moins un monomère ou oligomère multifonctionnel, d'au moins un amorceur radicalaire et éventuellement d'un agent de réticulation. La composition adhésive sensible à la pression de l'invention peut être utilisée avantageusement dans la production d'une puce à semiconducteur, une minipuce étant fixée à la couche d'adhésif sensible à la pression pendant le procédé de fabrication de puces pendant lequel une minipuce est produite. La composition adhésive peut être thermodurcie une fois la minipuce traitée, afin de permettre le retrait facile de cette dernière par perte d'adhésion de la composition adhésive consécutivement au thermodurcissage.
Également publié en tant que
US2006281863
Dernières données bibliographiques dont dispose le Bureau international