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1. WO2005001933 - COMPOSANT A SEMI-CONDUCTEUR A PUCES MULTIPLES ET PROCEDE DE REALISATION

Numéro de publication WO/2005/001933
Date de publication 06.01.2005
N° de la demande internationale PCT/EP2004/051154
Date du dépôt international 17.06.2004
Demande présentée en vertu du Chapitre 2 15.04.2005
CIB
H01L 25/065 2006.01
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
25Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
03les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes H01L27/-H01L51/132
04les dispositifs n'ayant pas de conteneurs séparés
065les dispositifs étant d'un type prévu dans le groupe H01L27/81
CPC
H01L 2224/13099
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
12Structure, shape, material or disposition of the bump connectors prior to the connecting process
13of an individual bump connector
13001Core members of the bump connector
13099Material
H01L 2224/16145
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
161Disposition
16135the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
16145the bodies being stacked
H01L 2224/16147
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
161Disposition
16135the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
16145the bodies being stacked
16147the bump connector connecting to a bonding area disposed in a recess of the surface
H01L 2224/81136
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
81using a bump connector
8112Aligning
81136involving guiding structures, e.g. spacers or supporting members
H01L 2224/81141
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
81using a bump connector
8112Aligning
81136involving guiding structures, e.g. spacers or supporting members
81138the guiding structures being at least partially left in the finished device
81141Guiding structures both on and outside the body
H01L 2224/81205
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
81using a bump connector
812Applying energy for connecting
81201Compression bonding
81205Ultrasonic bonding
Déposants
  • INFINEON TECHNOLOGIES AG [DE/DE]; St.-Martin-Str. 53 81669 München, DE (AllExceptUS)
  • MÜLLER, Karlheinz [DE/DE]; DE (UsOnly)
Inventeurs
  • MÜLLER, Karlheinz; DE
Mandataires
  • KINDERMANN, Peter ; Patentanwälte Kindermann P.O. Box 100234 85593 Baldham, DE
Données relatives à la priorité
103 29 222.528.06.2003DE
Langue de publication allemand (DE)
Langue de dépôt allemand (DE)
États désignés
Titre
(DE) MULTICHIP-HALBLEITERBAUSTEIN UND VERFAHREN ZU SEINER HERSTELLUNG
(EN) MULTICHIP SEMI-CONDUCTOR COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
(FR) COMPOSANT A SEMI-CONDUCTEUR A PUCES MULTIPLES ET PROCEDE DE REALISATION
Abrégé
(DE)
Die Erfindung betrifft einen Multichip-Halbleiterbaustein (1) mit mindestens einer Chipgruppe, die aus wenigstens zwei Halbleiterchips (2, 3) besteht, welche eine erste und eine zweite Oberflächenseite aufweisen und deren erste Oberflächenseiten einander zugekehrt sind, und bei dem die einander zugewandten Oberflächenseiten der Halbleiterchips (2, 3) jeweils eine räumliche Struktur (7) aufweisen, und dass die räumlichen Strukturen (7) formschlüssig derart ineinander greifen, dass die geometrische Zuordnung der einander zugekehrten Oberflächenseiten der Halbleiterchips (2, 3) eindeutig und die metallische Verbindung der einander zugekehrten Halbleiterchips (2, 3) sicher leitend ist, wobei die Montage der Halbleiterchips (2, 3) auf einer Maschinenanlage durch vibrieren der Halbleiterchips (2, 3) erfolgt.
(EN)
The invention relates to a multichip semi-conductor component (1) comprising at least one group of chips which is made of at least two semi-conductor chips (2, 3) having a first and a second surface side, whereby the first surface sides thereof face each other. The adjacent surface sides of the semi-conductor chips (2, 3) respectively have a spatial structure (7) and the spatial structures (7) engage with each other in a positive fit in such a manner that the geometric arrangement of the surface sides of the semi-conductor chips (2, 3), facing each other, is distinct and the metal connection of the semi-conductor chips (2, 3) facing each other is reliably conductive. The semi-conductor chips (2, 3) are mounted by vibrating said semi-conductor chips (2, 3) on a machine system.
(FR)
La présente invention concerne un composant à semi-conducteur à puces multiples (1) comprenant au moins un groupe de puces qui est composé d'au moins deux puces à semi-conducteur (2, 3) qui présentent un premier et un second côté et dont les premiers côtés sont adjacents entre eux. Selon l'invention, les côtés adjacents des puces à semi-conducteur (2, 3) présentent une structure spatiale (7) respective, les structures spatiales (7) s'encliquetant par liaison de forme de sorte que l'association géométrique des côtés adjacents des puces à semi-conducteur (2, 3), est univoque, et le composé métallique qui compose les puces à semi-conducteur (2, 3) adjacentes, est bon conducteur, le montage des puces à semi-conducteur (2, 3) s'effectuant sur une machine par vibration des puces à semi-conducteur (2, 3).
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