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1. WO2004101428 - PROCEDES ET APPAREIL PERMETTANT DE FIXER DES DISPOSITIFS MEMS SUR UN BOITIER

Numéro de publication WO/2004/101428
Date de publication 25.11.2004
N° de la demande internationale PCT/US2004/014268
Date du dépôt international 07.05.2004
Demande présentée en vertu du Chapitre 2 06.12.2004
CIB
B81B 7/00 2006.01
BTECHNIQUES INDUSTRIELLES; TRANSPORTS
81TECHNOLOGIE DES MICROSTRUCTURES
BDISPOSITIFS OU SYSTÈMES À MICROSTRUCTURE, p.ex. DISPOSITIFS MICROMÉCANIQUES
7Systèmes à microstructure
CPC
B81C 1/00333
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
00015for manufacturing microsystems
00261Processes for packaging MEMS devices
00333Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
G01C 19/5719
GPHYSICS
01MEASURING; TESTING
CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
19Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
56Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
5719using planar vibrating masses driven in a translation vibration along an axis
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
H01L 2224/83194
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
83using a layer connector
8319Arrangement of the layer connectors prior to mounting
83194Lateral distribution of the layer connectors
H01L 2224/83203
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
83using a layer connector
832Applying energy for connecting
83201Compression bonding
83203Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
Déposants
  • HONEYWELL INTERNATIONAL INC. [US]/[US] (AllExceptUS)
  • DCAMP, Jon, B. [US]/[US] (UsOnly)
  • GLENN, Max, C. [US]/[US] (UsOnly)
  • DUNAWAY, Lori, A. [US]/[US] (UsOnly)
  • CURTIS, Harlan, L. [US]/[US] (UsOnly)
Inventeurs
  • DCAMP, Jon, B.
  • GLENN, Max, C.
  • DUNAWAY, Lori, A.
  • CURTIS, Harlan, L.
Mandataires
  • HOIRIIS, David
Données relatives à la priorité
10/431,42007.05.2003US
Langue de publication anglais (EN)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) METHODS AND APPARATUS FOR ATTACHING MEMS DEVICES TO HOUSING
(FR) PROCEDES ET APPAREIL PERMETTANT DE FIXER DES DISPOSITIFS MEMS SUR UN BOITIER
Abrégé
(EN)
A method for increasing the bonding strength between a die (110) and a housing (202) for the die is described where a micro-electromechanical system (MEMS) device is formed on the die. The method comprises depositing a plurality of clusters (220) of contact material onto a bottom surface (240) of the housing, placing the die onto the clusters, and subjecting the housing, the clustered contacts (228), and the die to a thermocompression bonding process.
(FR)
L'invention concerne un procédé permettant d'augmenter la résistance à la liaison entre une puce (110) et un boîtier (202) pour la puce. Un dispositif à système mécanique microélectrique (MEMS) est formé sur la puce. Ce procédé consiste à déposer une pluralité d'agglomérats (220) de matériau de contact sur une surface de fond (240) du boîtier, à placer la puce sur les agglomérats et à soumettre le boîtier, les contacts agglomérés (228) et la puce à un processus de soudage par thermocompression.
Dernières données bibliographiques dont dispose le Bureau international