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1. WO2004056939 - CORPS LUMINESCENT ET DISPOSITIF OPTIQUE COMPRENANT CE CORPS LUMINESCENT

Numéro de publication WO/2004/056939
Date de publication 08.07.2004
N° de la demande internationale PCT/JP2003/016379
Date du dépôt international 19.12.2003
Demande présentée en vertu du Chapitre 2 30.01.2004
CIB
C09K 11/77 2006.01
CCHIMIE; MÉTALLURGIE
09COLORANTS; PEINTURES; PRODUITS À POLIR; RÉSINES NATURELLES; ADHÉSIFS; COMPOSITIONS NON PRÉVUES AILLEURS; UTILISATIONS DE SUBSTANCES, NON PRÉVUES AILLEURS
KSUBSTANCES POUR DES APPLICATIONS NON PRÉVUES AILLEURS; APPLICATIONS DE SUBSTANCES NON PRÉVUES AILLEURS
11Substances luminescentes, p.ex. électroluminescentes, chimiluminescentes
08contenant des substances inorganiques luminescentes
77contenant des métaux des terres rares
CPC
C09K 11/7792
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
11Luminescent, e.g. electroluminescent, chemiluminescent materials
08containing inorganic luminescent materials
77containing rare earth metals
7783containing two or more rare earth metals one of which being europium
7792Aluminates
C09K 11/7793
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
11Luminescent, e.g. electroluminescent, chemiluminescent materials
08containing inorganic luminescent materials
77containing rare earth metals
7783containing two or more rare earth metals one of which being europium
7793Germanates
H01L 2224/05001
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
04Structure, shape, material or disposition of the bonding areas prior to the connecting process
05of an individual bonding area
05001Internal layers
H01L 2224/05023
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
04Structure, shape, material or disposition of the bonding areas prior to the connecting process
05of an individual bonding area
05001Internal layers
0502Disposition
05023the whole internal layer protruding from the surface
H01L 2224/0508
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
04Structure, shape, material or disposition of the bonding areas prior to the connecting process
05of an individual bonding area
05001Internal layers
05075Plural internal layers
0508being stacked
H01L 2224/05568
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
04Structure, shape, material or disposition of the bonding areas prior to the connecting process
05of an individual bonding area
0554External layer
0556Disposition
05568the whole external layer protruding from the surface
Déposants
  • TOYODA GOSEI CO., LTD. [JP]/[JP] (AllExceptUS)
  • ROTH, Gundula [DE]/[DE]
  • TEWS, Walter [DE]/[DE]
Inventeurs
  • ROTH, Gundula
  • TEWS, Walter
Mandataires
  • HIRATA, Tadao
Données relatives à la priorité
102 59 945.920.12.2002DE
Langue de publication japonais (JA)
Langue de dépôt japonais (JA)
États désignés
Titre
(EN) LUMINESCENT BODY AND OPTICAL DEVICE INCLUDING THE SAME
(FR) CORPS LUMINESCENT ET DISPOSITIF OPTIQUE COMPRENANT CE CORPS LUMINESCENT
(JA) 発光体およびこれを用いた光デバイス
Abrégé
(EN)
A luminescent body of prolonged fluorescence lifetime characterized by comprising not only an activator but also at least one coactivator selected from the group consisting of La, Ce, Pr, Nd, Sm, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Bi, Sn, Sb and analogues thereof as a further luminescence center for enhancing the thermostability of luminescent body. This luminescent body excels in thermostability and fluorescence lifetime, so that it is useful as a luminescent body for LED.
(FR)
Cette invention se rapporte à un corps luminescent ayant une durée de fluorescence prolongée, qui se caractérise en ce qu'il comprend non seulement un activateur mais également au moins un co-activateur choisi dans le groupe composé de La, Ce, Pr, Nd, Sm, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Bi, Sn, Sb et d'analogues de ceux-ci comme autres centres de luminescence pour accroître la thermostabilité de ce corps luminescent. Ce corps luminescent possède d'excellentes propriétés de thermostabilité et de durée de fluorescence, ce qui le rend utile comme corps luminescent pour diodes électroluminescentes.
(JA)
not available
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