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Paramétrages

Paramétrages

1. WO2003008193 - APPAREIL DE TRAITEMENT DE SUBSTRAT

Numéro de publication WO/2003/008193
Date de publication 30.01.2003
N° de la demande internationale PCT/US2002/023206
Date du dépôt international 19.07.2002
Demande présentée en vertu du Chapitre 2 21.01.2003
CIB
B32B 37/22 2006.01
BTECHNIQUES INDUSTRIELLES; TRANSPORTS
32PRODUITS STRATIFIÉS
BPRODUITS STRATIFIÉS, c. à d. FAITS DE PLUSIEURS COUCHES DE FORME PLANE OU NON PLANE, p.ex. CELLULAIRE OU EN NID D'ABEILLES
37Procédés ou dispositifs pour la stratification, p.ex. par polymérisation ou par liaison à l'aide d'ultrasons
14caractérisés par les propriétés des couches
16toutes les couches existant et présentant une cohésion avant la stratification
22impliquant l'assemblage à la fois de couches individualisées et de couches continues
CPC
B32B 37/10
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
37Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
10characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
B32B 37/226
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
37Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
14characterised by the properties of the layers
16with all layers existing as coherent layers before laminating
22involving the assembly of both discrete and continuous layers
223One or more of the layers being plastic
226Laminating sheets, panels or inserts between two continuous plastic layers
Y10S 428/914
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
428Stock material or miscellaneous articles
914Transfer or decalcomania
Y10T 156/12
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
156Adhesive bonding and miscellaneous chemical manufacture
12Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
Y10T 156/171
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
156Adhesive bonding and miscellaneous chemical manufacture
17Surface bonding means and/or assemblymeans with work feeding or handling means
1702For plural parts or plural areas of single part
1705Lamina transferred to base from adhered flexible web or sheet type carrier
1707Discrete spaced laminae on adhered carrier
171Means serially presenting discrete base articles or separate portions of a single article
Y10T 156/18
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
156Adhesive bonding and miscellaneous chemical manufacture
18Surface bonding means and/or assembly means with handle or handgrip
Déposants
  • XYRON, INC. [US/US]; 15820 North 84th Street Scottsdale, AZ 85260, US
Inventeurs
  • KVAMME, Nathaniel, J.; US
  • HOFFMAN, Ronald, J.; US
  • WORTH, Cory, W.; US
  • REED, Daniel, G.; US
Mandataires
  • BARUFKA, Jack, S. ; Pillsbury Winthrop LLP 1600 Tysons Boulevard McLean, VI 22102, US
Données relatives à la priorité
60/306,43220.07.2001US
Langue de publication anglais (EN)
Langue de dépôt anglais (EN)
États désignés
Titre
(EN) SUBSTRATE PROCESSING APPARATUS
(FR) APPAREIL DE TRAITEMENT DE SUBSTRAT
Abrégé
(EN)
A substrate processing apparatus (10) includes a frame (14), first and second supply rolls (16, 18) and a substrate processing assembly including a resiliently deformable structure configured to apply pressure to the first and second supply rolls to perform a substrate processing operation. A method for processing a substrate (12) includes providing first and second supply rolls rotatably mounted to the substrate processing apparatus (10), wherein at least one of the first and second supply rolls has pressure-sensitive adhesive provided thereon. The selected substrate (12) is enabled to be fed in a substrate receiving opening with the first and the second substrates positioned on opposing sides thereof. The first and second substrates are advanced through the substrate receiving opening. A resiliently deformable structure deforms to apply pressure to the selected substrate and the first and second substrates as they are advanced through the substrate receiving opening, thereby bonding the adhesive to selected substrate
(FR)
L'invention concerne un appareil de traitement de substrat (10) comprenant un cadre (14), des premiers et seconds cylindres d'alimentation (16, 18) et un ensemble de traitement de substrat comportant une structure élastiquement déformable configurée de manière à pouvoir exercer une pression sur les premiers et seconds cylindres afin de procéder à une opération de traitement de substrat. L'invention porte aussi sur un procédé de traitement de substrat (12) consistant à fournir des premiers et seconds cylindres d'alimentation installés pivotants sur l'appareil de traitement de substrat (10), au moins le premier ou le second cylindre possédant un adhésif sensible à la pression installé dessus. Le substrat sélectionné (12) peut être alimenté dans une ouverture de réception de substrat au moyen des premiers et seconds substrats installés sur les côtés opposés. Les premiers et seconds substrats sont acheminés à travers l'ouverture de réception de substrat. Une structure élastiquement déformable se déforme afin d'exercer une pression sur le substrat sélectionné et sur les premiers et seconds substrats au fur et à mesure qu'ils sont acheminés à travers l'ouverture de réception de substrat, ce qui permet de fixer l'adhésif au substrat sélectionné.
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