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1. WO2003005445 - DISPOSITIF A SEMICONDUCTEUR ET MODULE A SEMICONDUCTEUR

Numéro de publication WO/2003/005445
Date de publication 16.01.2003
N° de la demande internationale PCT/JP2002/005853
Date du dépôt international 12.06.2002
CIB
H01L 25/10 2006.01
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
25Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
03les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes H01L27/-H01L51/132
10les dispositifs ayant des conteneurs séparés
H05K 1/02 2006.01
HÉLECTRICITÉ
05TECHNIQUES ÉLECTRIQUES NON PRÉVUES AILLEURS
KCIRCUITS IMPRIMÉS; ENVELOPPES OU DÉTAILS DE RÉALISATION D'APPAREILS ÉLECTRIQUES; FABRICATION D'ENSEMBLES DE COMPOSANTS ÉLECTRIQUES
1Circuits imprimés
02Détails
H05K 1/14 2006.01
HÉLECTRICITÉ
05TECHNIQUES ÉLECTRIQUES NON PRÉVUES AILLEURS
KCIRCUITS IMPRIMÉS; ENVELOPPES OU DÉTAILS DE RÉALISATION D'APPAREILS ÉLECTRIQUES; FABRICATION D'ENSEMBLES DE COMPOSANTS ÉLECTRIQUES
1Circuits imprimés
02Détails
14Association structurale de plusieurs circuits imprimés
H05K 1/18 2006.01
HÉLECTRICITÉ
05TECHNIQUES ÉLECTRIQUES NON PRÉVUES AILLEURS
KCIRCUITS IMPRIMÉS; ENVELOPPES OU DÉTAILS DE RÉALISATION D'APPAREILS ÉLECTRIQUES; FABRICATION D'ENSEMBLES DE COMPOSANTS ÉLECTRIQUES
1Circuits imprimés
18Circuits imprimés associés structurellement à des composants électriques non imprimés
CPC
H01L 2224/32225
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
321Disposition
32151the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
32221the body and the item being stacked
32225the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
H01L 2224/49175
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
49of a plurality of wire connectors
491Disposition
4912Layout
49175Parallel arrangements
H01L 2224/73265
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
732Location after the connecting process
73251on different surfaces
73265Layer and wire connectors
H01L 2225/1005
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2225Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
10the devices having separate containers
1005the devices being of a type provided for in group H01L27/00
Déposants
  • SONY CORPORATION [JP/JP]; 7-35, Kitashinagawa 6-chome Shinagawa-ku, Tokyo 141-0001, JP (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, KR, LU, MC, NL, PT, SE, TR)
  • FUKASAWA, Hiroyuki [JP/JP]; JP (UsOnly)
Inventeurs
  • FUKASAWA, Hiroyuki; JP
Mandataires
  • NAKAMURA, Tomoyuki; c/o Miyoshi International Patent Office 9th Floor, Toranomon Daiichi Building 2-3, Toranomon 1-chome Minato-ku, Tokyo 105-0001, JP
Données relatives à la priorité
2001-20307704.07.2001JP
Langue de publication japonais (JA)
Langue de dépôt japonais (JA)
États désignés
Titre
(EN) SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
(FR) DISPOSITIF A SEMICONDUCTEUR ET MODULE A SEMICONDUCTEUR
Abrégé
(EN)
A semiconductor device and semiconductor module having a compact structure and produced at low cost. A semiconductor module (M1) of a first working example comprises semiconductor devices (A1, A2, A3,...) in each of which, external connection electrodes (15, 16) are provided in the peripheral portions of both sides of a printed wiring board (10) and a semiconductor integrated circuit chip (1A) is mounted in the cetral portion. The external connection electrodes (15) of the semiconductor devices (A1, A3) are electrically connected to the external connection electrodes (16) of the semiconductor device (A2) directly or through chip components (30) and relay boards (40) (Fig. 8B) by solder (Sb).
(FR)
L'invention concerne un dispositif à semiconducteur et un module à semiconducteur de structure compacte, dont la fabrication est peu onéreuse. Le module (M1) décrit en premier exemple opérationnel comprend des dispositifs à semiconducteur (A1, A2, A3, ) équipés chacun d'électrodes de connexion externes (15, 16) sur les parties périphériques situées des deux côtés d'une carte imprimée (10), et une puce de circuit intégré à semiconducteur (1A) est montée sur la partie centrale. Les électrodes (15) des dispositifs à semiconducteur (A1, A2, A3, ) sont reliées aux électrodes (16) du dispositif à semiconducteur (A2), directement ou par le biais de composants de puce (30) et de cartes relais (40) au moyen d'une soudure (Sb).
Également publié en tant que
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