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1. WO2001075970 - ELEMENT ET PROCEDES DE CONNEXION DE COMPOSANTS D'UN ENSEMBLE ELECTRONIQUE

Note: Texte fondé sur des processus automatiques de reconnaissance optique de caractères. Seule la version PDF a une valeur juridique

[ EN ]

WHAT IS CLAIMED IS:

1. Interface element (1, 21) for connecting constituents of an electronic assembly comprising
a layer (2, 22) of dielectric material,
the layer having a pattern of regularly arranged openings,
said openings forming through connections, and
electrically conducting elements (3, 23, 23', 23") placed in said openings for electrically connecting constituents arranged on each side of the layer.

2. Element according to claim 1 wherein the dielectric layer (2, 22) of dielectric material is at least partially made of a curable organic dielectric material filled with a powder of inorganic material with high thermal conductivity.

3. Element according to claim 1 or 2, the layer (2, 22) of dielectric material having a surface which comprises adhesion means for mechanically fixing the constituents to each other.

4. Element according to any one of the preceding claims wherein the electrically conducting elements (3, 23, 23', 23") comprise a surface (7, 24, 24', 24") of a solder material.

5. Element according to any one of the preceding claims wherein the electrically conducting elements (23, 23', 23") are cylindrical.

6. Element according to any one of the preceding claims, the layer (2, 22) of dielectric material being slightly compressible.

7. Method for connecting constituents of an electronic, the constituents having joints at standardized places, the method comprising the steps of providing an interface element (1, 21) with a layer (2, 22) of dielectric material, the layer having a pattern of regularly arranged openings, distances between some of said openings corresponding to distances between joints of the constituents, said openings forming through connections and being filled with electrically conducting elements (3, 23, 23', 23"), pressing said constituents on different sides of said layer so that a reliable electrical contact is formed between the joints of the constituents and some of the electrically conducting elements.

A method according to claim 7, wherein the layer (2, 22) of dielectric material comprises curable material being cured simultaneously to the pressing of the constituents on the layer.

9. A method according to claim 7 or 8, wherein the electrically conducting elements are soldered or welded to joints of the constituents to be connected.