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1. WO1989000334 - CONSERVATION DE SUBSTRATS SEMI-CONDUCTEURS

Numéro de publication WO/1989/000334
Date de publication 12.01.1989
N° de la demande internationale PCT/JP1988/000404
Date du dépôt international 25.04.1988
Demande présentée en vertu du Chapitre 2 20.01.1989
CIB
H01L 21/673 2006.01
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
21Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de dispositifs à semi-conducteurs ou de dispositifs à l'état solide, ou bien de leurs parties constitutives
67Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
673utilisant des supports spécialement adaptés
CPC
H01L 21/67366
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
673using specially adapted carriers ; or holders; Fixing the workpieces on such carriers or holders
6735Closed carriers
67366characterised by materials, roughness, coatings or the like
H01L 21/67376
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
673using specially adapted carriers ; or holders; Fixing the workpieces on such carriers or holders
6735Closed carriers
67376characterised by sealing arrangements
H01L 21/67386
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
673using specially adapted carriers ; or holders; Fixing the workpieces on such carriers or holders
6735Closed carriers
67386characterised by the construction of the closed carrier
H01L 21/67389
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
673using specially adapted carriers ; or holders; Fixing the workpieces on such carriers or holders
6735Closed carriers
67389characterised by atmosphere control
H01L 21/67393
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
673using specially adapted carriers ; or holders; Fixing the workpieces on such carriers or holders
6735Closed carriers
67389characterised by atmosphere control
67393characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
Déposants
  • SUMITOMO ELECTRIC INDUSTRIES, LTD. [JP]/[JP] (AllExceptUS)
  • NAKAI, Ryusuke [JP]/[JP] (UsOnly)
Inventeurs
  • NAKAI, Ryusuke
Mandataires
  • FUKAMI, Hisao @
Données relatives à la priorité
62/17044008.07.1987JP
Langue de publication japonais (JA)
Langue de dépôt japonais (JA)
États désignés
Titre
(EN) PRESERVATION OF SEMICONDUCTOR SUBSTRATES
(FR) CONSERVATION DE SUBSTRATS SEMI-CONDUCTEURS
Abrégé
(EN)
This invention relates to a method of preserving semiconductor substrates at a temperature below 10°C. After the surface of each semiconductor substrate is cleansed by etching or the like, the substrate is put into a bag made of a synthetic resin sheet having a laminar structure containing an interposed metal foil, and the bag is hermetically sealed after charging it with an inert gas or evacuating the interior of the bag, and is preserved at a temperature below 10°C.
(FR)
Procédé permettant la conservation de substrats semi-conducteurs à une température inférieure à 10°C. Une fois la surface de chaque substrat semi-conducteur nettoyée par décapage ou analogue, le substrat est mis dans un sac réalisé à partir d'une feuille de résine synthétique dont la structure contient une feuille métallique intercalée. Le sac est ensuite fermé hermétiquement, après avoir été chargé d'un gaz inerte ou après que l'intérieur du sac ait été évacué, puis il est conservé à une température inférieure à 10°C.
Également publié en tant que
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