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1. (WO1986003214) MELANGES DE RESINE POLYAMIDE
Note: Texte fondé sur des processus automatiques de reconnaissance optique de caractères. Seule la version PDF a une valeur juridique

C L A I M S

1. Polyamide resin composition consisting of 100 parts by weight of a polyamide containing tetramethylene adipamide as main component and 0,01 to 3 parts by weight of at least one compound selected out of the groups of aminosilanes, epoxysilanes and vinylsilanes. 2. Polyamide resin composition according to claim 1 containing 0.02 to 2 parts by weight of at least one compound selected out of the group of aminosilanes, epoxysilanes and vinylsilanes.
3. Polyamide resin composition according to claim 1 containing at least one compound selected out of the group of ϒ-aminopropyltrimethoxysilane, ϒ-aminopropyltriethoxysilane, ϒ-glycidoxypropyltrimethoxysilane, vinyltrimethoxysilane and ϒ-methacryloxypropyltriethoxysilane.
4. Molds mainly consisting of a polyamide resin composition according to one of the claims 1-3.
5. Process for the preparation of a thermal stabilized polyamide composition containing tetramethylene adipamide as main component by the addition of 0,01 to 3 parts by weight of at least one compound selected out of the groups of aminosilanes, epoxysilanes and vinylsilanes to 100 parts by weight of the polyamide in the melt.