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1. US20080003737 - Method of manufacturing MEMS devices providing air gap control

Office
États-Unis d'Amérique
Numéro de la demande 11478702
Date de la demande 30.06.2006
Numéro de publication 20080003737
Date de publication 03.01.2008
Numéro de délivrance 7527998
Date de délivrance 05.05.2009
Type de publication B2
CIB
H01L 21/00
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
21Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de dispositifs à semi-conducteurs ou de dispositifs à l'état solide, ou bien de leurs parties constitutives
CPC
B81B 3/0072
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
3Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
0064Constitution or structural means for improving or controlling the physical properties of a device
0067Mechanical properties
0072For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
B81B 2201/042
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2201Specific applications of microelectromechanical systems
04Optical MEMS
042Micromirrors, not used as optical switches
B81C 1/00047
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
00015for manufacturing microsystems
00023without movable or flexible elements
00047Cavities
B81C 2201/0167
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
2201Manufacture or treatment of microstructural devices or systems
01in or on a substrate
0161Controlling physical properties of the material
0163Controlling internal stress of deposited layers
0167by adding further layers of materials having complementary strains, i.e. compressive or tensile strain
Déposants Qualcomm Mems Technologies, Inc.
Inventeurs Tung Ming-Hau
Kogut Lior
Mandataires Knobbe, Martens, Olson & Bear, LLP.
Titre
(EN) Method of manufacturing MEMS devices providing air gap control
Abrégé
(EN)

Methods and apparatus are provided for controlling a depth of a cavity between two layers of a light modulating device. A method of making a light modulating device includes providing a substrate, forming a sacrificial layer over at least a portion of the substrate, forming a reflective layer over at least a portion of the sacrificial layer, and forming one or more flexure controllers over the substrate, the flexure controllers configured so as to operably support the reflective layer and to form cavities, upon removal of the sacrificial layer, of a depth measurably different than the thickness of the sacrificial layer, wherein the depth is measured perpendicular to the substrate.