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1. US20210051249 - CAMERA MODULE HAVING CHAMFER, PHOTOSENSITIVE ASSEMBLY, PREPARATION METHOD, AND ELECTRONIC DEVICE

Office
États-Unis d'Amérique
Numéro de la demande 17043381
Date de la demande 12.04.2019
Numéro de publication 20210051249
Date de publication 18.02.2021
Type de publication A1
CIB
H04N 5/225
HÉLECTRICITÉ
04TECHNIQUE DE LA COMMUNICATION ÉLECTRIQUE
NTRANSMISSION D'IMAGES, p.ex. TÉLÉVISION
5Détails des systèmes de télévision
222Circuits de studio; Dispositifs de studio; Equipements de studio
225Caméras de télévision
CPC
H04N 5/2252
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
225Television cameras ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
2251Constructional details
2252Housings
H04N 5/2253
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
225Television cameras ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
2251Constructional details
2253Mounting of pick-up device, electronic image sensor, deviation or focusing coils
Déposants Ningbo Sunny Opotech Co., Ltd.
Inventeurs Bojie ZHAO
Dongli YUAN
Zhen HUANG
QiMin MEl
Zhenyu CHEN
Titre
(EN) CAMERA MODULE HAVING CHAMFER, PHOTOSENSITIVE ASSEMBLY, PREPARATION METHOD, AND ELECTRONIC DEVICE
Abrégé
(EN)

This invention provides a camera module having a chamfer, a photosensitive assembly, a preparation method, and an electronic device. The photosensitive assembly of the camera module having the chamfer includes: a photosensitive element; a circuit board, wherein the photosensitive element is electrically connected and attached to the circuit board, and wherein the circuit board has a circuit board chamfer; and a molded body having a light window and a molded body chamfer, wherein the molded body chamfer and the circuit board chamfer are correspondingly arranged to form a chamfer portion suitable for forming a chamfer structure of the camera module, and wherein the molded body is molded on the circuit board and encapsulates the photosensitive element, so that the camera module may be installed at a corner of the electronic device, thereby increasing the screen-to-body ratio.


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