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1. MYPI 20040912 - RESIST COMPOSITION AND ORGANIC SOLVENT FOR REMOVING RESIST

Office Malaisie
Numéro de la demande PI 20040912
Date de la demande 16.03.2004
Numéro de publication PI 20040912
Date de publication 24.10.2004
Type de publication A
CIB
G03F 7/42
GPHYSIQUE
03PHOTOGRAPHIE; CINÉMATOGRAPHIE; TECHNIQUES ANALOGUES UTILISANT D'AUTRES ONDES QUE DES ONDES OPTIQUES; ÉLECTROGRAPHIE; HOLOGRAPHIE
FPRODUCTION PAR VOIE PHOTOMÉCANIQUE DE SURFACES TEXTURÉES, p.ex. POUR L'IMPRESSION, POUR LE TRAITEMENT DE DISPOSITIFS SEMI-CONDUCTEURS; MATÉRIAUX À CET EFFET; ORIGINAUX À CET EFFET; APPAREILLAGES SPÉCIALEMENT ADAPTÉS À CET EFFET
7Production par voie photomécanique, p.ex. photolithographique, de surfaces texturées, p.ex. surfaces imprimées; Matériaux à cet effet, p.ex. comportant des photoréserves; Appareillages spécialement adaptés à cet effet
26Traitement des matériaux photosensibles; Appareillages à cet effet
42Elimination des réserves ou agents à cet effet
Déposants AZ ELECTRONIC MATERIALS (JAPAN) K.K.
Inventeurs DOEK-MAN KANG
SAE-TAE OH
HYUK-JOONG KWON
EIJI NAITO
Mandataires DAVID ALAN WYATT*
Données relatives à la priorité 1020030026029 24.04.2003 KR
Titre
(EN) RESIST COMPOSITION AND ORGANIC SOLVENT FOR REMOVING RESIST
Abrégé
(EN)
THE PRESENT INVENTION PROVIDES A RESIST COMPOSITION COMPRISING BENZYL ALCOHOL OR ITS DERIVATIEVS AS AN ORGANIC SOLVENT.SPECIFICALLY, THE PRESENT INVENTION PROVIDES A POSITIVE PHOTORESIST COMPOSITION COMPRISING AN ALKALINE SOLUBLE NOVOLAK RESIN, A NAPHTHOQUINONEDIAZIDE PHOTOSENSITIVE COMPOUND AND AN ORGANIC SOLVENT, CHARACTERIZED IN THAT THE ORGANIC SOLVENT COMPRISES BENZYL ALCOHOL OR ITS DERIVATIVES; AND A NEGATIVE PHOTORESIST COMPOSITION COMPRISING AN ALKALINE SOLUBLE ACRYLIC RESIN OR NOVOLAK RESIN, A STRONG ACID OR A RADICAL GENERATING COMPOUND BY IRRADIATION WITH UV RAYS, A CROSSLINKER AND AN ORGANIC SOLVENT, CHARACTERIZED IN THAT THE ORGANIC SOLVENT COMPRISES BENZYL ALCOHOL OR ITS DERIVATIVES.THE PRESENT INVENTION ALSO PROVIDES AN ORGANIC SOLVENT FOR REMOVING A RESIST, WHEREIN THE ORGANIC SOLVENT COMPRISES BENZYL ALCOHOL OR ITS DERIVATIVES.THE RESIST COMPOSITION OF THE PRESENT INVENTION IS USED IN A LITHOGRAPHY PROCESS FOR FORMING A MICRO-PATTERN USING A DIFFERENCE IN THE SOLUBILITY BETWEEN THE IRRADIATED PART AND THE NON-IRRADIATED PART BY IRRADIATION WITH UV RAYS TO GREATLY IMPROVE THE UNIFORMITY OF THE FILM THICKNESS UPIN COATING OF THE THIN FILM. IN ADDITION, THE ORGANIC SOLVENT ACCORDING TO THE PRESENT INVENTION CAN BE USED TO WASH THE EQUIPMENT, WHICH COMES INTO CONTACT WITH THE PHOTOSENSITIVE MATERIAL IN THE COURSE OF THE MICORCIRCUIT FORMING PROCESS, BY REMOVING THE PHOTOSENSITIVE MATERIAL FROM THE EQUIPMENT. IT ALSO CAN REMOVE THE PHOTOSENSITIVE MATERIAL REMAINING ON THE UNDERSIRED PARTS OF THE SUBSTRATE ON WHICH THE PHOTOSENSITIVE MATERIAL IS COATED.

Également publié en tant que
US2006263714