THE PRESENT INVENTION PROVIDES A RESIST COMPOSITION COMPRISING BENZYL ALCOHOL OR ITS DERIVATIEVS AS AN ORGANIC SOLVENT.SPECIFICALLY, THE PRESENT INVENTION PROVIDES A POSITIVE PHOTORESIST COMPOSITION COMPRISING AN ALKALINE SOLUBLE NOVOLAK RESIN, A NAPHTHOQUINONEDIAZIDE PHOTOSENSITIVE COMPOUND AND AN ORGANIC SOLVENT, CHARACTERIZED IN THAT THE ORGANIC SOLVENT COMPRISES BENZYL ALCOHOL OR ITS DERIVATIVES; AND A NEGATIVE PHOTORESIST COMPOSITION COMPRISING AN ALKALINE SOLUBLE ACRYLIC RESIN OR NOVOLAK RESIN, A STRONG ACID OR A RADICAL GENERATING COMPOUND BY IRRADIATION WITH UV RAYS, A CROSSLINKER AND AN ORGANIC SOLVENT, CHARACTERIZED IN THAT THE ORGANIC SOLVENT COMPRISES BENZYL ALCOHOL OR ITS DERIVATIVES.THE PRESENT INVENTION ALSO PROVIDES AN ORGANIC SOLVENT FOR REMOVING A RESIST, WHEREIN THE ORGANIC SOLVENT COMPRISES BENZYL ALCOHOL OR ITS DERIVATIVES.THE RESIST COMPOSITION OF THE PRESENT INVENTION IS USED IN A LITHOGRAPHY PROCESS FOR FORMING A MICRO-PATTERN USING A DIFFERENCE IN THE SOLUBILITY BETWEEN THE IRRADIATED PART AND THE NON-IRRADIATED PART BY IRRADIATION WITH UV RAYS TO GREATLY IMPROVE THE UNIFORMITY OF THE FILM THICKNESS UPIN COATING OF THE THIN FILM. IN ADDITION, THE ORGANIC SOLVENT ACCORDING TO THE PRESENT INVENTION CAN BE USED TO WASH THE EQUIPMENT, WHICH COMES INTO CONTACT WITH THE PHOTOSENSITIVE MATERIAL IN THE COURSE OF THE MICORCIRCUIT FORMING PROCESS, BY REMOVING THE PHOTOSENSITIVE MATERIAL FROM THE EQUIPMENT. IT ALSO CAN REMOVE THE PHOTOSENSITIVE MATERIAL REMAINING ON THE UNDERSIRED PARTS OF THE SUBSTRATE ON WHICH THE PHOTOSENSITIVE MATERIAL IS COATED.