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1. MYPI 97003659 - SEMICONDUCTOR DEVICE TESTING APPARATUS

Office
Malaisie
Numéro de la demande PI 97003659
Date de la demande 09.08.1997
Numéro de publication PI 97003659
Date de publication 15.09.2011
Type de publication A
CIB
G01R 31/02
GPHYSIQUE
01MÉTROLOGIE; TESTS
RMESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES
31Dispositions pour tester les propriétés électriques; Dispositions pour la localisation des pannes électriques; Dispositions pour tests électriques caractérisées par ce qui est testé, non prévues ailleurs
02Essai des appareils, des lignes ou des composants électriques pour y déceler la présence de courts-circuits, de discontinuités, de fuites ou de connexions incorrectes de lignes
Déposants ADVANTEST CORPORATION
Inventeurs YOSHIHITO KOBAYASHI
AKIHIKO ITO
Mandataires HARIRAM JAYARAM
Données relatives à la priorité 211584/96 09.08.1996 JP
Titre
(EN) SEMICONDUCTOR DEVICE TESTING APPARATUS
Abrégé
(EN) A SEMICONDUCTOR DEVICE TESTING APPARATUS IS PROVIDED WHICH ALLOWS FOR ELIMINATING THE NEED TO REPLACE IC SOCKETS EVEN IF THE TYPE OF IC PACKAGE IS CHANGED. A DEVICE RECEIVING CARRIER 100 ACCOMMODATING THE IC TO BE TESTED HAS ITS BOTTOM OPEN. A FINE CONDUCTIVE WIRE-EMBEDDED MEMBER 110 IS MOUNTED TO THE OPEN BOTTOM OF THE DEVICE RECEIVING CARRIER. THE WIRE-EMBEDDED MEMBER COMPRISES A RESILIENT RUBBER PLAYE 111 AND A NUMBER OF FINE CONDUCTIVE WIRES 112 EMBEDDED IN THE RUBBER PLATE, THE FINE CONDUCTIVE WIRES BEING ELECTRICALLY INSULATED FROM EACH OTHER AND EXTENDING THROUGH THE THICKNESS OF THE RUBBER PLATE WITH THE OPPOSITE ENDS EXPOSED AT THE OPPOSED SURFACES OF THE RUBBER PLATE. THE IC TO BE TESTED IS RESTED ON THE WIRE-EMBEDDED MEMBER. A BOARD 70 IS MOUNTED TO THE TEST HEAD, SAID BOARD HAVING GOLD PADS 72 FORMED IN A MANNER ELECTRICALLY INSULATED FROM EACH OTHER IN THE SURFACE THEREOF AT AT LEAST THE POSITIONS OPPOSING THE TERMINALS OF THE IC TO BE TESTED PLACED ON THE TOP SURFACE OF THE WIRE-EMBEDDED MEMBER. DURING THE TESTING OF THE IC IN THE TEST SECTION, THE BOTTOM SURFACE OF THE WIRE-EMBEDDED MEMBER IS PUT INTO CONTACT WITH THE BOARD TO ESTABLISH ELECTRICAL CONNECTION BETWEEN THE TERMINALS OF THE IC AND THE CORRESPONDING GOLD PADS OF THE BOARD THROUGH THE FINE CONDUCTIVE WIRES OF THE WIRE-EMBEDDED MEMBER.(FIG. 1)