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1. KR1020060090206 - METHOD FOR MANUFACTURING HEAT SINK OF MEMORY MODULE, PARTICULARLY CAPABLE OF IMPROVING GOODS QUALITY BY PREVENTING DIRECT CONTACT OF THE HEAT SINK

Office
République de Corée
Numéro de la demande 1020060066502
Date de la demande 14.07.2006
Numéro de publication 1020060090206
Date de publication 10.08.2006
Numéro de délivrance 1007780220000
Date de délivrance 21.11.2007
Type de publication B1
CIB
G06F 1/20
GPHYSIQUE
06CALCUL; COMPTAGE
FTRAITEMENT ÉLECTRIQUE DE DONNÉES NUMÉRIQUES
1Détails non couverts par les groupes G06F3/-G06F13/89
16Détails ou dispositions de structure
20Moyens de refroidissement
G06F 1/00
GPHYSIQUE
06CALCUL; COMPTAGE
FTRAITEMENT ÉLECTRIQUE DE DONNÉES NUMÉRIQUES
1Détails non couverts par les groupes G06F3/-G06F13/89
Déposants IL CHANG PRECISION CO., LTD.
주식회사 일창프리시젼
Inventeurs MYUNG, YUN KYUNG
명윤경
Mandataires 배용철
Titre
(EN) METHOD FOR MANUFACTURING HEAT SINK OF MEMORY MODULE, PARTICULARLY CAPABLE OF IMPROVING GOODS QUALITY BY PREVENTING DIRECT CONTACT OF THE HEAT SINK
(KO) 메모리모듈용 히트싱크 제조방법
Abrégé
(EN)

PURPOSE: A method for manufacturing a heat sink of a memory module is provided to largely save a manufacturing cost with remarkable productivity improvement by handing multiple heat sinks as a continuously arranged single body in a process such as extraction, painted, and contact pad drawing, and enhance goods quality by preventing scratches in transport/handling, as direct contact of the heat sink is prevented.

CONSTITUTION: The heat sink(11) is extracted as a continuous heat sink array(10) of a continuously arranged single body with regular intervals through a bridge(12) in a cutting/extracting press machine. The continuous heat sink array is pained, the contact pad is attached to the painted continuous heat sink array, and the bridge is cut and removed. The bridge of the continuous heat sink array comprises the first bridge(12a) for connecting the heat sink to a left/right side and the second bridge(12b) for connecting between the first bridges and keeping the interval of the heat sinks at an outer side of the first bridge.

© KIPO 2006

(KO)
본 발명은 취출, 착색 및 접착패드 취부 등의 단계에서 복수의 히트싱크가 소정 간격으로 연속배열된 단일체로 취급되어 생산성을 획기적으로 향상시킴으로 제조원가를 절감함과 아울러 가공 및 조립단계에서 취급시 히트싱크에 대한 직접 접촉이 차단되어 스크래치 발생을 방지함으로써 상품성을 향상시키도록 하는 메모리모듈용 히트싱크 제조방법에 관한 것이다.

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