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1. KR1020090045145 - POLISHING COMPOSITION FOR SILICON WAFER, COMPOSITION KIT FOR SILICON WAFER POLISHING, AND METHODS OF POLISHING SILICON WAFER

Office
République de Corée
Numéro de la demande 1020087022367
Date de la demande 12.09.2008
Numéro de publication 1020090045145
Date de publication 07.05.2009
Numéro de délivrance 1013511040000
Date de délivrance 14.01.2014
Type de publication B1
CIB
C09K 3/14
CCHIMIE; MÉTALLURGIE
09COLORANTS; PEINTURES; PRODUITS À POLIR; RÉSINES NATURELLES; ADHÉSIFS; COMPOSITIONS NON PRÉVUES AILLEURS; UTILISATIONS DE SUBSTANCES, NON PRÉVUES AILLEURS
KSUBSTANCES POUR DES APPLICATIONS NON PRÉVUES AILLEURS; APPLICATIONS DE SUBSTANCES NON PRÉVUES AILLEURS
3Substances non couvertes ailleurs
14Substances antidérapantes; Abrasifs
Déposants DUPONT AIR PRODUCTS NANOMATERIALS LLC
Inventeurs IWATA NAOYUKI
NAGASHIMA ISAO
Données relatives à la priorité 2006 2006071503 15.03.2006 JP
Titre
(EN) POLISHING COMPOSITION FOR SILICON WAFER, COMPOSITION KIT FOR SILICON WAFER POLISHING, AND METHODS OF POLISHING SILICON WAFER
Abrégé
(EN)
A polishing composition with which a native oxide deposit on a silicon wafer can be removed and silicon polishing can be efficiently conducted. The polishing composition comprises colloidal ceria and optionally contains an alkaline polishing composition. This composition may further contain a chelating agent. Also provided are: a polishing method comprising the step of removing an oxide deposit with colloidal ceria; a polishing method comprising the step of removing an oxide deposit with colloidal ceria and the subsequent step of polishing the silicon wafer with an alkaline polishing composition; and a polishing method comprising the step of polishing a silicon wafer with a polishing composition comprising colloidal ceria and an alkaline polishing composition. Furthermore provided is a polishing composition kit comprising colloidal ceria and an alkaline polishing composition. ©KIPO&WIPO 2009