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1. JP2007248187 - ANGULAR VELOCITY SENSOR

Office
Japon
Numéro de la demande 2006070601
Date de la demande 15.03.2006
Numéro de publication 2007248187
Date de publication 27.09.2007
Numéro de délivrance 4935126
Date de délivrance 02.03.2012
Type de publication B2
CIB
G01C 19/5628
GPHYSIQUE
01MÉTROLOGIE; TESTS
CMESURE DES DISTANCES, DES NIVEAUX OU DES RELÈVEMENTS; GÉODÉSIE; NAVIGATION; INSTRUMENTS GYROSCOPIQUES; PHOTOGRAMMÉTRIE OU VIDÉOGRAMMÉTRIE
19Gyroscopes; Dispositifs sensibles à la rotation utilisant des masses vibrantes; Dispositifs sensibles à la rotation sans masse en mouvement; Mesure de la vitesse angulaire en utilisant les effets gyroscopiques
56Dispositifs sensibles à la rotation utilisant des masses vibrantes, p.ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis
5607utilisant des diapasons vibrants
5628Fabrication; Ajustage; Montage; Boîtiers
CPC
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
H01L 2924/16152
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
15Details of package parts other than the semiconductor or other solid state devices to be connected
161Cap
1615Shape
16152Cap comprising a cavity for hosting the device, e.g. U-shaped cap
H01L 2924/19105
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
191Disposition
19101of discrete passive components
19105in a side-by-side arrangement on a common die mounting substrate
Déposants MATSUSHITA ELECTRIC IND CO LTD
パナソニック株式会社
Inventeurs UEDA SHINJIRO
上田 真二郎
NAKAJIMA KOICHIRO
中島 耕一郎
Mandataires 内藤 浩樹
永野 大介
藤井 兼太郎
Titre
(EN) ANGULAR VELOCITY SENSOR
(JA) 角速度センサ
Abrégé
(EN)

PROBLEM TO BE SOLVED: To provide a downsized angular velocity sensor.

SOLUTION: This angular velocity sensor is equipped with a substrate 1 having a recessed part 2, an IC 3 mounted in the recessed part 2 of the substrate 1, and first and second vibration elements 4 and 5 mounted on the substrate 1 and electrically connected to the IC 3. The IC 3 is facedown mounted in the recessed part 2 of the substrate 1 while the vibration elements 4 and 5 are partly positioned on the IC 3.

COPYRIGHT: (C)2007,JPO&INPIT

(JA)

【課題】本発明は小型化を図ることができる角速度センサを提供することを目的とするものである。
【解決手段】凹部2を有する基板1と、この基板1の凹部2に実装されたIC3と、前記基板1に実装され、かつ前記IC3に電気的に接続された第1の振動素子4および第2の振動素子5とを備え、前記IC3を基板1の凹部2にフェイスダウンにより実装するとともに、前記IC3上に前記第1の振動素子4と第2の振動素子5の一部が位置するように構成したものである。
【選択図】図1