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1. JPWO2004056939 - 発光体およびこれを用いた光デバイス

Office
Japon
Numéro de la demande 2004562061
Date de la demande 19.12.2003
Numéro de publication WO2004056939
Date de publication 08.07.2004
Numéro de délivrance 4102803
Date de délivrance 28.03.2008
Type de publication B2
CIB
C09K 11/64
CCHIMIE; MÉTALLURGIE
09COLORANTS; PEINTURES; PRODUITS À POLIR; RÉSINES NATURELLES; ADHÉSIFS; COMPOSITIONS NON PRÉVUES AILLEURS; UTILISATIONS DE SUBSTANCES, NON PRÉVUES AILLEURS
KSUBSTANCES POUR DES APPLICATIONS NON PRÉVUES AILLEURS; APPLICATIONS DE SUBSTANCES NON PRÉVUES AILLEURS
11Substances luminescentes, p.ex. électroluminescentes, chimiluminescentes
08contenant des substances inorganiques luminescentes
64contenant de l'aluminium
H01L 33/00
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
33Dispositifs à semi-conducteurs ayant au moins une barrière de potentiel ou une barrière de surface, spécialement adaptés pour l'émission de lumière; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Détails
C09K 11/66
CCHIMIE; MÉTALLURGIE
09COLORANTS; PEINTURES; PRODUITS À POLIR; RÉSINES NATURELLES; ADHÉSIFS; COMPOSITIONS NON PRÉVUES AILLEURS; UTILISATIONS DE SUBSTANCES, NON PRÉVUES AILLEURS
KSUBSTANCES POUR DES APPLICATIONS NON PRÉVUES AILLEURS; APPLICATIONS DE SUBSTANCES NON PRÉVUES AILLEURS
11Substances luminescentes, p.ex. électroluminescentes, chimiluminescentes
08contenant des substances inorganiques luminescentes
66contenant du germanium, de l'étain ou du plomb
CPC
C09K 11/7792
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
11Luminescent, e.g. electroluminescent, chemiluminescent materials
08containing inorganic luminescent materials
77containing rare earth metals
7783containing two or more rare earth metals one of which being europium
7792Aluminates
C09K 11/7793
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
11Luminescent, e.g. electroluminescent, chemiluminescent materials
08containing inorganic luminescent materials
77containing rare earth metals
7783containing two or more rare earth metals one of which being europium
7793Germanates
H01L 2224/05001
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
04Structure, shape, material or disposition of the bonding areas prior to the connecting process
05of an individual bonding area
05001Internal layers
H01L 2224/05023
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
04Structure, shape, material or disposition of the bonding areas prior to the connecting process
05of an individual bonding area
05001Internal layers
0502Disposition
05023the whole internal layer protruding from the surface
H01L 2224/0508
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
04Structure, shape, material or disposition of the bonding areas prior to the connecting process
05of an individual bonding area
05001Internal layers
05075Plural internal layers
0508being stacked
H01L 2224/05568
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
04Structure, shape, material or disposition of the bonding areas prior to the connecting process
05of an individual bonding area
0554External layer
0556Disposition
05568the whole external layer protruding from the surface
Déposants 豊田合成株式会社
ロット グンドゥラ
テウス ヴァルター
Inventeurs ロット グンドゥラ
テウス ヴァルター
Mandataires 平田 忠雄
Données relatives à la priorité 10259945 20.12.2002 DE
Titre
(JA) 発光体およびこれを用いた光デバイス
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