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1. IN202017049306 - NOVEL HIGH PIXEL IMAGE SENSOR

Office
Inde
Numéro de la demande 202017049306
Date de la demande 11.11.2020
Numéro de publication 202017049306
Date de publication 12.02.2021
Type de publication A
CIB
H01L
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
H04N
HÉLECTRICITÉ
04TECHNIQUE DE LA COMMUNICATION ÉLECTRIQUE
NTRANSMISSION D'IMAGES, p.ex. TÉLÉVISION
H05K
HÉLECTRICITÉ
05TECHNIQUES ÉLECTRIQUES NON PRÉVUES AILLEURS
KCIRCUITS IMPRIMÉS; ENVELOPPES OU DÉTAILS DE RÉALISATION D'APPAREILS ÉLECTRIQUES; FABRICATION D'ENSEMBLES DE COMPOSANTS ÉLECTRIQUES
Déposants DONGGUAN WANGFU ELECTRONIC CO., LTD
Inventeurs XIAO, Wenxiong
CHEN, Jinhua
MO, Linxi
Données relatives à la priorité 201820581700.8 23.04.2018 CN
Titre
(EN) NOVEL HIGH PIXEL IMAGE SENSOR
Abrégé
(EN) A novel high pixel image sensor, comprising a lens (1), a motor (2), a glass filter plate (3), an isolating base (4), an image sensor (5), a substrate (6), and an FPC flexible board (7), the lens (1) being mounted at the centre of the motor (2), a positioning step (41) being positioned above the isolating base (4), the positioning step (41) being embedded in an inner cavity of the motor (2), the glass filter plate (3) being attached to the middle of the isolating base (4), the substrate (6) being attached below the isolating base (4), a capacitive resistor (61) and a motor drive IC (62) being attached to the periphery of the substrate (6), a plurality of solder balls (63) distributed in a matrix being disposed on the bottom of the substrate (6), a recessed groove (71) corresponding to the position of the solder balls (63) being disposed on the FPC flexible board (7), the solder balls (63) being embedded in the recessed groove (71) in order to integrally weld the substrate (6) and the FPC flexible board (7), the image sensor (5) being connected to the base (6) by means of gold wires (8), the substrate (6) precisely transmitting data to the FPC flexible board (7), and there being multiple solder ball (63) matrix distributions, meeting high pixel requirements; the high pixel image sensor can achieve better performance, and the isolating base (4) can isolate the image sensor (5) and the capacitive resistor (61) and motor drive IC (62), avoiding contamination during secondary patching work.
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