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1. CN102742098 - Semiconductor laser assembly and packaging system

Office
Chine
Numéro de la demande 201080061694.X
Date de la demande 19.11.2010
Numéro de publication 102742098
Date de publication 17.10.2012
Numéro de délivrance 102742098
Date de délivrance 10.02.2016
Type de publication B
CIB
H01S 5/022
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
SDISPOSITIFS UTILISANT LE PROCÉDÉ D'AMPLIFICATION DE LA LUMIÈRE PAR ÉMISSION STIMULÉE DE RAYONNEMENT POUR AMPLIFIER OU GÉNÉRER DE LA LUMIÈRE; DISPOSITIFS UTILISANT L’ÉMISSION STIMULÉE DE RAYONNEMENT ÉLECTROMAGNÉTIQUE DANS DES GAMMES D’ONDES AUTRES QU'OPTIQUES
5Lasers à semi-conducteurs
02Détails ou composants structurels non essentiels au fonctionnement laser
022Supports; Boîtiers
H01S 5/024
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
SDISPOSITIFS UTILISANT LE PROCÉDÉ D'AMPLIFICATION DE LA LUMIÈRE PAR ÉMISSION STIMULÉE DE RAYONNEMENT POUR AMPLIFIER OU GÉNÉRER DE LA LUMIÈRE; DISPOSITIFS UTILISANT L’ÉMISSION STIMULÉE DE RAYONNEMENT ÉLECTROMAGNÉTIQUE DANS DES GAMMES D’ONDES AUTRES QU'OPTIQUES
5Lasers à semi-conducteurs
02Détails ou composants structurels non essentiels au fonctionnement laser
024Dispositions pour le refroidissement
CPC
H01L 2224/49175
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
49of a plurality of wire connectors
491Disposition
4912Layout
49175Parallel arrangements
H01S 5/005
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
005Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
H01S 5/02
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
H01S 5/02212
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
02208characterised by the shape of the housings
02212Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
H01S 5/02469
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
024Arrangements for thermal management
02469Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
H01S 5/02253
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
0225Out-coupling of light
02253using lenses
Déposants 赛米尼克斯有限公司
Inventeurs D·M·比恩
J·J·克拉汉
Mandataires 广州嘉权专利商标事务所有限公司 44205
Données relatives à la priorité 12623886 23.11.2009 US
Titre
(EN) Semiconductor laser assembly and packaging system
(ZH) 半导体激光器组装与包装系统
Abrégé
(EN)
A system for self-aligning assembly and packaging of semiconductor lasers allows reduction of time, cost and testing expenses for high power density systems. A laser package mounting system (100), such as a modified TO-can (transistor outline can), has modifications that increase heat transfer from the active laser to a heat exchanger or other heat sink. A prefabricated heat exchanger assembly mounts both a laser package and one or more lenses (101). Direct mounting of a fan assembly to the package further minimizes assembly steps. Components may be physically and optically aligned during assembly by clocking and other indexing means, so that the entire system (100) is self-aligned and focused by the assembly process without requiring post-assembly adjustment. This system (100) can lower costs and thereby enable the use of high powered semiconductor lasers in low cost, high volume production, such as consumer items.

(ZH)

本发明涉及自对准组装和半导体激光器包装系统,其可以减少高功率密度系统的时间、成本和检测费用。如改进的TO-罐形(晶体管外形的罐)激光器包装安装系统(100),对其进行的改进增加了自主动激光器向换热器或其他换热器(103)的传热。预制换热器装置安装有激光器包装和一个或多个透镜(101)。风扇装置直接安装到该包装上进一步最小化组装步骤。组装过程中,各部件通过同步或其他分度工具实现物理和光学上的对准,由此整个系统(100)完成自对准,并通过该组装过程进行聚焦,而不需要后装配调整。该系统(100)可以降低成本,从而使高功率半导体激光器低成本使用、大批量生产,如消费项目。

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