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1. CN101454896 - Flexible joint methodology to attach a die on an organic substrate

Office
Chine
Numéro de la demande 200780019804.4
Date de la demande 26.06.2007
Numéro de publication 101454896
Date de publication 10.06.2009
Numéro de délivrance 101454896
Date de délivrance 16.11.2011
Type de publication B
CIB
H01L 23/02
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
23Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
02Conteneurs; Scellements
H01L 21/52
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
21Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de dispositifs à semi-conducteurs ou de dispositifs à l'état solide, ou bien de leurs parties constitutives
02Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
04les dispositifs présentant au moins une barrière de potentiel ou une barrière de surface, p.ex. une jonction PN, une région d'appauvrissement, ou une région de concentration de porteurs de charges
50Assemblage de dispositifs à semi-conducteurs en utilisant des procédés ou des appareils non couverts par l'un uniquement des groupes H01L21/06-H01L21/326185
52Montage des corps semi-conducteurs dans les conteneurs
CPC
H01L 24/72
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
71Means for bonding not being attached to, or not being formed on, the surface to be connected
72Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
H01L 23/3675
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
367Cooling facilitated by shape of device
3675characterised by the shape of the housing
H01L 24/90
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
90Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected, e.g. pressure contacts using springs or clips
H01L 2224/81191
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
81using a bump connector
8119Arrangement of the bump connectors prior to mounting
81191wherein the bump connectors are disposed only on the semiconductor or solid-state body
H01L 2224/81899
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
81using a bump connector
818Bonding techniques
81897Mechanical interlocking, e.g. anchoring, hook and loop-type fastening or the like
81898Press-fitting, i.e. pushing the parts together and fastening by friction, e.g. by compression of one part against the other
81899using resilient parts in the bump connector or in the bonding area
H01L 2224/83136
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
83using a layer connector
8312Aligning
83136involving guiding structures, e.g. spacers or supporting members
Déposants Intel Corp.
英特尔公司
Inventeurs Ogata Kazuo
K·大方
Fukuo Tsuyoshi
T·福尾
Ishiyama Seiji
S·石山
Koh Tetsuhide
T·高
Mandataires chen songtao
永新专利商标代理有限公司 72002
Données relatives à la priorité 11479633 29.06.2006 US
Titre
(EN) Flexible joint methodology to attach a die on an organic substrate
(ZH) 用于将管芯附着到有机基板上的柔性接头方法
Abrégé
(EN)
In some embodiments, flexible joint methodology to attach a die on an organic substrate is presented. In this regard, an integrated circuit chip package substrate is introduced having an organic substrate, an interposer coupled with a surface of the organic substrate, the interposer having cavities to accept bumps of a die, and a flexible tape layer coupled with a surface of the interposer, the flexible tape layer to couple with bumps of the die. Other embodiments are also disclosed and claimed.

(ZH)

在一些实施例中,提供了用于将管芯附着到有机基板上的柔性接头方法。就此而言,引入了一种集成电路芯片封装基板,其具有有机基板、与所述有机基板的表面耦合的内插器以及与所述内插器的表面耦合的柔性带层,其中,所述内插器具有用于容纳管芯的凸块的腔,所述柔性带层用于与所述管芯的凸块耦合。此外,还公开了其他实施例,并要求保护它们的权益。

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