Traitement en cours

Veuillez attendre...

Paramétrages

Paramétrages

Aller à Demande

1. CN101160667 - A hybrid bulk-soi 6t-sram cell for improved cell stability and performance

Office Chine
Numéro de la demande 200680011974.3
Date de la demande 27.03.2006
Numéro de publication 101160667
Date de publication 09.04.2008
Numéro de délivrance 101160667
Date de délivrance 16.06.2010
Type de publication B
CIB
H01L 29/94
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
29Dispositifs à semi-conducteurs spécialement adaptés au redressement, à l'amplification, à la génération d'oscillations ou à la commutation et ayant au moins une barrière de potentiel ou une barrière de surface; Condensateurs ou résistances ayant au moins une barrière de potentiel ou une barrière de surface, p.ex. jonction PN, région d'appauvrissement, ou région de concentration de porteurs de charges; Détails des corps semi-conducteurs ou de leurs électrodes
66Types de dispositifs semi-conducteurs
86commandés uniquement par la variation du courant électrique fourni, ou uniquement par la tension électrique appliquée, à l'une ou plusieurs des électrodes transportant le courant à redresser, amplifier, faire osciller, ou commuter
92Condensateurs avec barrière de potentiel ou barrière de surface
94Dispositifs à métal-isolant-semi-conducteur, p.ex. MOS
CPC
H01L 27/1104
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
04the substrate being a semiconductor body
10including a plurality of individual components in a repetitive configuration
105including field-effect components
11Static random access memory structures
1104the load element being a MOSFET transistor
G11C 11/412
GPHYSICS
11INFORMATION STORAGE
CSTATIC STORES
11Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
21using electric elements
34using semiconductor devices
40using transistors
41forming ; static; cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger
412using field-effect transistors only
H01L 21/84
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
78with subsequent division of the substrate into plural individual devices
82to produce devices, e.g. integrated circuits, each consisting of a plurality of components
84the substrate being other than a semiconductor body, e.g. being an insulating body
H01L 27/11
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
04the substrate being a semiconductor body
10including a plurality of individual components in a repetitive configuration
105including field-effect components
11Static random access memory structures
H01L 27/1203
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
1203the substrate comprising an insulating body on a semiconductor body, e.g. SOI
H01L 27/1207
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
1203the substrate comprising an insulating body on a semiconductor body, e.g. SOI
1207combined with devices in contact with the semiconductor body, i.e. bulk/SOI hybrid circuits
Déposants IBM
国际商业机器公司
Inventeurs Chang Leland
L·钱格
Narasimha Shreesh
S·纳拉西姆哈
Rohrer Norman J.
N·J·罗勒
Sleight Jeffrey W.
J·W·斯莱特
Mandataires wangmao hua
北京市金杜律师事务所 11256
Données relatives à la priorité 11108012 15.04.2005 US
Titre
(EN) A hybrid bulk-soi 6t-sram cell for improved cell stability and performance
(ZH) 改进单元稳定性和性能的混合块SOI 6T-SRAM单元
Abrégé
(EN)
The present invention provides a 6T-SRAM semiconducting structure including a substrate having an SOI region and a bulk-Si region, wherein the SOI region and the bulk-Si region have a same or differing crystallographic orientation; an isolation region separating the SOI region from the bulk-Si region; and at least one first device located in the SOI region and at least one second device located in the bulk-Si region. The SOI region has an silicon layer atop an insulating layer. The bulk-Si region further comprises a well region underlying the second device and a contact to the well region, wherein the contact stabilizes floating body effects. The well contact is also used to control the threshold voltages of the FETs in the bulk-Si region to optimized the power and performance of the SRAM cell built from the combination of the SOI and bulk-Si region FETs.

(ZH)

本发明提供一种6T-SRAM半导体结构,包括:具有SOI区域和块Si区域的衬底,其中SOI区域和块Si区域具有相同或者不同的晶体取向;将SOI区域与块Si区域分离的隔离区域;以及位于SOI区域中的至少一个第一器件和位于块Si区域中的至少一个第二器件。SOI区域具有在绝缘层之上的硅层。块Si区域还包括在第二器件下方的阱区域和到阱区域的接触,其中该接触稳定浮体效应。阱接触也用来控制块Si区域中FET的阈值电压以优化从SOI和块Si区域FET的组合中构建的SRAM单元的功率和性能。

Également publié en tant que