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1. CN1198817 - Semiconductor device testing apparatus

Office
Chine
Numéro de la demande 97191059.6
Date de la demande 08.08.1997
Numéro de publication 1198817
Date de publication 11.11.1998
Numéro de délivrance 1083985
Date de délivrance 01.05.2002
Type de publication C
CIB
H01L 21/66
HÉLECTRICITÉ
01ÉLÉMENTS ÉLECTRIQUES FONDAMENTAUX
LDISPOSITIFS À SEMI-CONDUCTEURS; DISPOSITIFS ÉLECTRIQUES À L'ÉTAT SOLIDE NON PRÉVUS AILLEURS
21Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de dispositifs à semi-conducteurs ou de dispositifs à l'état solide, ou bien de leurs parties constitutives
66Test ou mesure durant la fabrication ou le traitement
G01R 31/26
GPHYSIQUE
01MÉTROLOGIE; TESTS
RMESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES
31Dispositions pour tester les propriétés électriques; Dispositions pour la localisation des pannes électriques; Dispositions pour tests électriques caractérisées par ce qui est testé, non prévues ailleurs
26Test de dispositifs individuels à semi-conducteurs
CPC
G01R 1/0466
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
04Housings; Supporting members; Arrangements of terminals
0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
0433Sockets for IC's or transistors
0441Details
0466concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
G01R 31/26
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
26Testing of individual semiconductor devices
H01L 22/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
22Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Déposants Advantest Corp.
株式会社爱德万测试
Inventeurs Ito Akihiko
伊藤明彦
Kobayashi Yoshihito
小林义仁
Mandataires wang jinggang
北京市柳沈律师事务所
Données relatives à la priorité 211584/96 09.08.1996 JP
Titre
(EN) Semiconductor device testing apparatus
(ZH) 半导体元件测试装置
Abrégé
(EN) A semiconductor device testing apparatus which does not need to change an IC socket with another even when the kind of IC package is changed. A bottom portion of a device storage carrier (100) in which IC's to be tested are stored is opened, and a conductive thin wire-buried member (110) comprising an elastic rubber plate (111), and a large number of conductive thin wires (112) buried in a mutually insulated state in the rubber plate so that these wires extend in the direction of the thickness of the rubber plate and are exposed at both end portions thereof to the outside of both surfaces of the rubber plate is fixed to the opened bottom portion of the device storage carrier, IC's to be tested being placed on this conductive thin wire-buried member. A board (70) provided with gold pads, which are formed in a mutually insulated state, is fixed to a test head in positions thereof which correspond at least to the terminals of the IC's to be tested placed on the upper surface of the conductive thin wire-buried member. When the IC's are tested in a test section, the lower surface of the conductive thin wire-buried member is brought into contact with the board, and the terminals of these IC's to be tested and the corresponding conductive pads on the board are thereby connected together electrically through the conductive thin wires.
(ZH)

提供一种半导体元件测试装置,便于在即使IC组件类型变化时免除更换各IC插座的必要性。一容纳有待测试的IC的元件容放托架100具有其敞开的底部。一纤细导线埋置构件110安装于元件容放托架的敞开底部。此导线埋置构件包括一弹性的橡胶板件111和许多埋置在橡胶板件之中的纤细导线112,各纤细导线在电气上彼此绝缘并穿过橡胶板件的厚度,而对置的两端在橡胶板件的对置两表面处外露出来。有待测试的IC置放在导线埋置构件上。一垫板70装于测试头,所述垫板具有在其表面上以电气上绝缘的方式、在至少对置于安放在导线埋置构件顶面上有待测试的IC各终端的各位置上所制成的一些金垫。在IC在测试部分中经受测试期间,导线埋置构件的底面与垫板接触以便通过导线埋置构件的各纤细导线建立IC的各终端与垫板的各相应金垫之间的电气连接。