Commentaires
Paramétrages

Paramétrages

Aller à Demande

1. CN103196437 - 角速度传感器及其制造方法

Lien permanent
Office
Chine
Numéro de la demande 201310052385.1
Date de la demande 07.03.2007
Numéro de publication 103196437
Date de publication 10.07.2013
Numéro de délivrance 103196437
Date de délivrance 06.04.2016
Type de publication B
CIB
G01C 19/5607
GPHYSIQUE
01MÉTROLOGIE; TESTS
CMESURE DES DISTANCES, DES NIVEAUX OU DES RELÈVEMENTS; GÉODÉSIE; NAVIGATION; INSTRUMENTS GYROSCOPIQUES; PHOTOGRAMMÉTRIE OU VIDÉOGRAMMÉTRIE
19Gyroscopes; Dispositifs sensibles à la rotation utilisant des masses vibrantes; Dispositifs sensibles à la rotation sans masse en mouvement; Mesure de la vitesse angulaire en utilisant les effets gyroscopiques
56Dispositifs sensibles à la rotation utilisant des masses vibrantes, p.ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis
5607utilisant des diapasons vibrants
G01C 19/5628
GPHYSIQUE
01MÉTROLOGIE; TESTS
CMESURE DES DISTANCES, DES NIVEAUX OU DES RELÈVEMENTS; GÉODÉSIE; NAVIGATION; INSTRUMENTS GYROSCOPIQUES; PHOTOGRAMMÉTRIE OU VIDÉOGRAMMÉTRIE
19Gyroscopes; Dispositifs sensibles à la rotation utilisant des masses vibrantes; Dispositifs sensibles à la rotation sans masse en mouvement; Mesure de la vitesse angulaire en utilisant les effets gyroscopiques
56Dispositifs sensibles à la rotation utilisant des masses vibrantes, p.ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis
5607utilisant des diapasons vibrants
5628Fabrication; Ajustage; Montage; Boîtiers
CPC
G01C 19/5607
GPHYSICS
01MEASURING; TESTING
CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
19Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
56Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
5607using vibrating tuning forks
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
H01L 2224/97
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
93Batch processes
95at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
97the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
H01L 2924/19105
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
191Disposition
19101of discrete passive components
19105in a side-by-side arrangement on a common die mounting substrate
Déposants 松下知识产权经营株式会社
Inventeurs 上田真二郎
毛利浩明
中岛耕一郎
Mandataires 北京市中咨律师事务所 11247
北京市中咨律师事务所 11247
Données relatives à la priorité 2006070601 15.03.2006 JP
2006070602 15.03.2006 JP
2006070603 15.03.2006 JP
2006070604 15.03.2006 JP
2006070605 15.03.2006 JP
2006070606 15.03.2006 JP
Titre
(ZH) 角速度传感器及其制造方法
front page image
Abrégé
(ZH)

本发明提供一种角速度传感器，其具备：基板，其具有形成有第1凹部的上表面；电子部件，其装配在所述第1凹部内；第1振动元件，其与所述电子部件电连接，安装在所述基板的所述上表面上，并且具有位于所述电子部件的正上方的部分；以及第1粘合剂，将所述电子部件接合到所述第1凹部，所述第1凹部具有：装配部，装配着所述电子部件；以及注入部，其不装配所述电子部件，与所述装配部相邻，用于注入所述第1粘合剂，所述注入部的至少一部分位于所述第1振动元件的正下方该角速度传感器可以小型化。
Documents de brevet associés
JP2007248187
JP2007248188
JP2007248189
JP2007248190
JP2007248191
JP2007248192
US20090165557
CN101400970
WO/2007/105559
# -