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1. CN105075411 - 多层配线基板的制造方法

Office Chine
Numéro de la demande 201480018681.2
Date de la demande 25.03.2014
Numéro de publication 105075411
Date de publication 18.11.2015
Numéro de délivrance 105075411
Date de délivrance 16.11.2018
Type de publication B
CIB
H05K 3/46
HÉLECTRICITÉ
05TECHNIQUES ÉLECTRIQUES NON PRÉVUES AILLEURS
KCIRCUITS IMPRIMÉS; ENVELOPPES OU DÉTAILS DE RÉALISATION D'APPAREILS ÉLECTRIQUES; FABRICATION D'ENSEMBLES DE COMPOSANTS ÉLECTRIQUES
3Appareils ou procédés pour la fabrication de circuits imprimés
46Fabrication de circuits multi-couches
C25D 7/00
CCHIMIE; MÉTALLURGIE
25PROCÉDÉS ÉLECTROLYTIQUES OU ÉLECTROPHORÉTIQUES; APPAREILLAGES À CET EFFET
DPROCÉDÉS POUR LA PRODUCTION ÉLECTROLYTIQUE OU ÉLECTROPHORÉTIQUE DE REVÊTEMENTS; GALVANOPLASTIE; JONCTION DE PIÈCES PAR ÉLECTROLYSE; APPAREILLAGES À CET EFFET
7Dépôt électrochimique caractérisé par l'objet à revêtir
H05K 3/42
HÉLECTRICITÉ
05TECHNIQUES ÉLECTRIQUES NON PRÉVUES AILLEURS
KCIRCUITS IMPRIMÉS; ENVELOPPES OU DÉTAILS DE RÉALISATION D'APPAREILS ÉLECTRIQUES; FABRICATION D'ENSEMBLES DE COMPOSANTS ÉLECTRIQUES
3Appareils ou procédés pour la fabrication de circuits imprimés
40Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
42Trous de passage métallisés
CPC
H05K 3/421
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
42Plated through-holes ; or plated via connections
421Blind plated via connections
C23C 18/1653
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
1601Process or apparatus
1633Process of electroless plating
1646Characteristics of the product obtained
165Multilayered product
1653Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
C23C 18/405
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
31Coating with metals
38Coating with copper
40using reducing agents
405Formaldehyde
C25D 3/38
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
3Electroplating: Baths therefor
02from solutions
38of copper
C25D 5/02
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
02Electroplating of selected surface areas
C25D 5/10
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
10Electroplating with more than one layer of the same or of different metals
Déposants 日立化成株式会社
Inventeurs 吉田信之
吉田信之
Mandataires 北京银龙知识产权代理有限公司 11243
北京银龙知识产权代理有限公司 11243
北京银龙知识产权代理有限公司 11243
北京银龙知识产权代理有限公司 11243
Données relatives à la priorité 2013069058 28.03.2013 JP
Titre
(ZH) 多层配线基板的制造方法
Abrégé
(ZH)
一种多层配线基板的制造方法,其在形成有配线的内层材上将绝缘层和在其上层的金属箔层叠一体化,在所述金属箔和绝缘层中设置通孔用孔,形成基底无电解镀层后,利用填充电镀层将所述通孔用孔填埋,其中,所述基底无电解镀层形成后,首先形成不完全填充所述通孔用孔程度的填充电镀层,接着将所述填充电镀层表面蚀刻,然后通过填充电镀层将所述通孔用孔完全填埋。

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