Traitement en cours

Veuillez attendre...

Paramétrages

Paramétrages

Aller à Demande

1. AU1998082805 - Method and apparatus for semiconductor wafer and lcd inspection using multidimensional image decomposition and synthesis

Office Australie
Numéro de la demande 82805/98
Date de la demande 01.07.1998
Numéro de publication 1998082805
Date de publication 18.03.1999
Type de publication A
CIB
H04N 7/18
HÉLECTRICITÉ
04TECHNIQUE DE LA COMMUNICATION ÉLECTRIQUE
NTRANSMISSION D'IMAGES, p.ex. TÉLÉVISION
7Systèmes de télévision
18Systèmes de télévision en circuit fermé, c. à d. systèmes dans lesquels le signal n'est pas diffusé
G01N 21/956
GPHYSIQUE
01MÉTROLOGIE; TESTS
NRECHERCHE OU ANALYSE DES MATÉRIAUX PAR DÉTERMINATION DE LEURS PROPRIÉTÉS CHIMIQUES OU PHYSIQUES
21Recherche ou analyse des matériaux par l'utilisation de moyens optiques, c. à d. en utilisant des rayons infrarouges, visibles ou ultraviolets
84Systèmes spécialement adaptés à des applications particulières
88Recherche de la présence de criques, de défauts ou de souillures
95caractérisée par le matériau ou la forme de l'objet à analyser
956Inspection de motifs sur la surface d'objets
G06T 7/00
GPHYSIQUE
06CALCUL; COMPTAGE
TTRAITEMENT OU GÉNÉRATION DE DONNÉES D'IMAGE, EN GÉNÉRAL
7Analyse d'image
CPC
G06T 7/0004
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
7Image analysis
0002Inspection of images, e.g. flaw detection
0004Industrial image inspection
G01N 21/956
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
84Systems specially adapted for particular applications
88Investigating the presence of flaws or contamination
95characterised by the material or shape of the object to be examined
956Inspecting patterns on the surface of objects
G06T 2207/10056
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
2207Indexing scheme for image analysis or image enhancement
10Image acquisition modality
10056Microscopic image
G06T 2207/20016
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
2207Indexing scheme for image analysis or image enhancement
20Special algorithmic details
20016Hierarchical, coarse-to-fine, multiscale or multiresolution image processing; Pyramid transform
G06T 2207/30121
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
2207Indexing scheme for image analysis or image enhancement
30Subject of image; Context of image processing
30108Industrial image inspection
30121CRT, LCD or plasma display
G06T 2207/30148
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
2207Indexing scheme for image analysis or image enhancement
30Subject of image; Context of image processing
30108Industrial image inspection
30148Semiconductor; IC; Wafer
Déposants NeoPath, Inc.
Inventeurs Lee, Shih-Jong J
Nelson, Larry A.
Données relatives à la priorité 08888116 03.07.1997 US
Titre
(EN) Method and apparatus for semiconductor wafer and lcd inspection using multidimensional image decomposition and synthesis
Abrégé
(EN)
An automatic wafer inspection system (10) having a wafer storage and loading module (18) and a wafer storage and unloading module (20), transports a wafer (15) to and from an automated stage (16) that moves the wafer (15) under a microscope (17) for scanning. A sensing device (12) images the area of the wafer (15) under inspection. A processing unit (22), having a host computer (21), multiple controllers (23), a high speed image processing unit (25), and a power supply (27), controls the scanning of the wafer and performs the image decomposition, synthesis and image processing (Fig. 2) for automatic inspection. A computer (21), decomposes the raw image data (26) into a set of partial information channels having command spatial relations (35). Each channel reflects predetermined aspects of the information. The partial information can thus be processed using image processing techniques independently or cooperatively. Partial information images may be synthesized (Fig. 7) to recover the original image or to derive an improved image for automation inspection. The system acquires an image (24), performs an image decomposition (26) on the image to generate a decomposition data set (35) of spatial frequency and orientation bandpass component images that represent the decomposition of the input image (26), performs multiple channel feature detection and enhancement on the decomposition data set (28), performs image synthesis (30) and defect detection (32).

Également publié en tant que