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1. AU1997037850 - Semiconductor device testing apparatus

Office
Australie
Numéro de la demande 37850/97
Date de la demande 08.08.1997
Numéro de publication 1997037850
Date de publication 07.05.1998
Type de publication A
CIB
G01R 1/04
GPHYSIQUE
01MÉTROLOGIE; TESTS
RMESURE DES VARIABLES ÉLECTRIQUES; MESURE DES VARIABLES MAGNÉTIQUES
1Détails ou dispositions des appareils des types couverts par les groupes G01R5/-G01R13/125
02Éléments structurels généraux
04Boîtiers; Organes de support; Agencements des bornes
CPC
G01R 1/0466
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
04Housings; Supporting members; Arrangements of terminals
0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
0433Sockets for IC's or transistors
0441Details
0466concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
G01R 31/26
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
26Testing of individual semiconductor devices
H01L 22/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
22Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Déposants Advantest Corporation
Inventeurs Ito, Akihiko
Kobayashi, Yoshihito
Données relatives à la priorité 8-211584 09.08.1996 JP
Titre
(EN) Semiconductor device testing apparatus
Abrégé
(EN) A semiconductor device testing apparatus which does not need to change an IC socket with another even when the kind of IC package is changed. A bottom portion of a device storage carrier (100) in which IC's to be tested are stored is opened, and a conductive thin wire-buried member (110) comprising an elastic rubber plate (111), and a large number of conductive thin wires (112) buried in a mutually insulated state in the rubber plate so that these wires extend in the direction of the thickness of the rubber plate and are exposed at both end portions thereof to the outside of both surfaces of the rubber plate is fixed to the opened bottom portion of the device storage carrier, IC's to be tested being placed on this conductive thin wire-buried member. A board (70) provided with gold pads (72), which are formed in a mutually insulated state, is fixed to a test head in positions thereof which correspond at least to the terminals of the IC's to be tested placed on the upper surface of the conductive thin wire-buried member. When the IC's are tested in a test section (21), the lower surface of the conductive thin wire-buried member is brought into contact with the board, and the terminals of these IC's to be tested and the corresponding conductive pads on the board are thereby connected together electrically through the conductive thin wires.