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1. WO2020163547 - RÉSEAU DE CAPTEURS TACTILES INDUCTIFS MULTIPLEXÉS

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[ EN ]MODIFIÉESinitiales

AMENDED CLAIMS

received by the International Bureau on 18 June 2020 (18.06.2020)

1. An apparatus comprising:

a plurality of inductive senseis arranged in an array comprising rows and columns, each of the senseis comprising a drive coil and a sense coil, wherein:

windings of both the drive coil and the sense coil of each sensei are wound in the same direction and attach to a first side of a substrate;

the drive coils of the senseis in each column are connected in series; and

the sense coils of the senseis in each row are connected in series; and

circuitry configured to independently select individual ones of the inductive senseis by activating the drive coils of the senseis in one of the columns and the sense coils of the senseis in one of the rows, wherein the sensei at an intersection of the activated column and row is selected and an output of the selected sensei is measured by the circuitry.

2. The apparatus of claim 1 wherein the circuitry performs a scan by individually selecting and measuring outputs of each of the senseis of the array in series.

3. The apparatus of claim 2 wherein the circuitry generates a matrix of measurements corresponding to locations of the corresponding senseis in the array.

4. The apparatus of claim 3 wherein the circuitry generates a time-series of matrices of measurements corresponding to locations of the corresponding senseis in the array.

5. The apparatus of claim 1 wherein the circuitry comprises drive circuitry connected to the drive coils of the senseis, comprising an AC current source and a demultiplexer.

6. The apparatus of claim 1 wherein the circuitry comprises sense circuitry connected to the sense coils of the senseis, comprising a multiplexer and an analog-to-digital converter.

7. The apparatus of claim 1 wherein the senseis are disposed on a printed circuit board (PCB) and a first compressible dielectric layer is disposed on a first side of the PCB.

8. The apparatus of claim 7 comprising a first deformable conductive shield layer disposed on the first compressible dielectric layer such that the first deformable conductive shield layer is separated from the PCB by the first compressible dielectric layer.

9. The apparatus of claim 8 comprising a second compressible dielectric layer disposed between a second side of the PCB and a second deformable conductive shield layer.

10. The apparatus of claim 7 comprising conductive targets disposed on a deformable dielectric film layer disposed on a first compressible dielectric layer which is disposed on the first side of the PCB.

11. The apparatus of claim 10 comprising a second compressible dielectric layer disposed between the second side of the PCB and a deformable conductive shield layer.

12. The apparatus of claim 1 wherein the windings of both the drive coil and the sense coil of each sensei are wound in the same direction and attach also to a second side of a substrate.

13. The apparatus of claim 1 wherein:

the drive coils of senseis that are adjacent in each column are wound in opposite directions; the drive coils of senseis that are adjacent in each row are wound in opposite directions;

the sense coils of senseis that are adjacent in each row are wound in opposite directions;

and the sense coils of senseis that are adjacent in each column are wound in opposite directions.

14. The apparatus of claim 1 wherein the senseis are arranged in groups and wherein each conductive target partially covers a group of four senseis with which the target is associated, an elastomer layer disposed between the senseis and the conductive target.

15. The apparatus of claim 14 wherein the circuitry measures applied force in three axes based on the output.

16. The apparatus of claim 15 wherein each conductive target has a corner-truncated square shape.

17. A tactile sensor comprising:

an array of inductive multiplexed senseis comprising multiple groups;

a plurality of electrically conductive targets, each target configured to cover a portion of each of the senseis of one of the groups in the absence of applied external force;

an elastomer disposed between the targets and the senseis; and

circuitry configured to drive a selected group of the senseis and measure an output of one of the senseis of the selected group.

18. The tactile sensor of claim 17 wherein outputs of the senseis of the selected group indicate applied mechanical force in three axes .

19. A method comprising:

with a tactile sensor comprising an array of inductive multiplexed senseis comprising multiple groups of senseis, each group associated with an electrically conductive target that covers a portion of each of the senseis of the group in the absence of applied external force, driving the senseis of a selected group of senseis with a current source, wherein the group comprises fewer than all senseis of the array; and

measuring an output of one of the senseis of the selected group.

20. The method of claim 19 comprising calculating applied mechanical force in three axes from outputs of the senseis of the selected group.