WO/2017/033470 ADDITIVE COMPOSITION FOR MANUFACTURING NEW WATER AND OIL MIXTURE FUEL||WO||02.03.2017|
||PCT/JP2016/053209||WORLD BUSINESS CO., LTD.||MATSUO Junichi|
The present invention provides an additive composition for manufacturing a new water and oil mixture fuel which is visually transparent, has a high gross heating value and a low specific gravity. This additive composition for manufacturing the new water and oil mixture fuel includes, for example, in a hydrocarbon-based solvent, component (a) which is castor oil or olive oil, component (b) which is a nonionic surfactant having an HLB of 8.0-15.5, and component (c) which is carbon, the content of the component (a) being 3-10 weight%, the content of the component (b) being 3-10 weight%, and the content of the component (c) being 20-40 weight%.
WO/2017/026077 SEMICONDUCTOR DEVICE BONDING WIRE||WO||16.02.2017|
||PCT/JP2015/076487||NIPPON MICROMETAL CORPORATION||ODA, Daizo|
Provided is a Cu bonding wire that has a Pd coating layer on the surface, that improves bonding reliability at a ball joining part in a high-temperature high-humidity environment, and that is suitable for on-board devices. This semiconductor device bonding wire has a Cu alloy core material and a Pd coating layer formed on the surface of the Cu alloy core material, wherein the bonding wire contains Ga and Ge by a total of 0.011-1.2 mass%. With this, the lifespan of the bonding at a ball joining part in a high-temperature high-humidity environment is improved, and bonding reliability can be improved. The thickness of the Pd coating layer is preferably 0.015-0.150 μm. Reliability of the ball joining part at a high temperature environment at 175°C or higher can be improved when the bonding wire further contains at least one of Ni, Ir, and Pt each by 0.011-1.2 mass%. In addition, wedge bonding property is improved when an alloy surface skin layer containing Au and Pd is further included in the surface of the Pd coating layer.
WO/2017/013817 BONDING WIRE FOR SEMICONDUCTOR DEVICE||WO||26.01.2017|
||PCT/JP2015/086550||NIPPON MICROMETAL CORPORATION||YAMADA, Takashi|
Provided is a bonding wire for a semiconductor device, said bonding wire comprising a coating layer composed primarily of Pd on the surface of a Cu alloy core, and a cover alloy layer containing Au and Pd on the surface of the coating layer, wherein second bonding performance is further improved in a Pd-plated lead frame, and excellent ball bonding performance can be achieved even under high humidity and heat conditions. In the bonding wire for a semiconductor device, said bonding wire comprising a coating layer composed primarily of Pd on the surface of a Cu alloy core, and a cover alloy layer containing Au and Pd on the surface of the coating layer, the concentration of Cu on the outermost surface of the wire is set at 1–10 at%, and the core contains 0.1–3.0 mass%, in total, of the metal elements in group 10 of the periodic table, thus improving second bonding performance and enabling excellent ball bonding performance to be achieved under high humidity and heat conditions. In addition, the maximum concentration of Au in the cover alloy layer is preferably 15–75 at%.
WO/2017/010015 SMOKELESS INCINERATOR AND SYSTEM USING SAME||WO||19.01.2017|
||PCT/JP2015/070649||SEC ELEVATOR CO., LTD.||SUZUKI Takao|
[Problem] To provide a smokeless incinerator that can suppress generation of black smoke by completely combusting uncombusted gases and that does not have the risk of damaging a burner in a combustion chamber even when combustion is sufficiently performed. [Solution] The present invention includes: a primary combustion chamber A comprising a main combustion section A1 in which an object to be combusted is placed and that includes a refractory brick wall A12 and a combustion assistance burner A31 for assisting combustion, and a water-cooling jacket section A2 that is disposed on the refractory brick section A1 and that includes a water-cooling jacket wall A27; a secondary combustion chamber B that is disposed above the primary combustion chamber A and that includes a re-combustion burner B1; a tertiary combustion chamber D that includes a dust-collecting cyclone D3 and a combustion chamber C having a filter, which are sequentially aligned on a single line on the side of the secondary combustion chamber B; a quaternary combustion chamber E that is disposed above the tertiary combustion chamber D and that includes a re-combustion burner E1; and an exhaust pipe F that includes forceful exhaust means F2 and F5.
WO/2017/002132 SYSTEM AND METHOD FOR OPTIMIZING AND ENHANCING VISIBILITY OF THE WEBSITE||WO||05.01.2017|
||PCT/IN2016/000169||NOWFLOATS TECHNOLOGIES PVT. LTD.||RAMTEK, Arpan, Samuel|
The present invention provides a method and system for optimizing by intelligently prompting one or more websites to enhance visibility of the website in a search conducted by a search engine and involves configuring one or more rules based on outcome of machine learning by analyzing the search engine configuration and ranking parameters responsible to improve rank of the websites, and dynamically creating a processor adapted to run multi-threads for each of the one or more websites, analyzing the one or more websites based on the said one or more rules, determining one or more parameters based on the analysis of the one or more websites, and intimating website's owner for one or more actions to be taken based on the one or more parameters through one or more communication medium, thereby enhancing website's chances of discovery.
WO/2016/203659 BONDING WIRE FOR SEMICONDUCTOR DEVICE||WO||22.12.2016|
||PCT/JP2015/070861||NIPPON MICROMETAL CORPORATION||YAMADA, Takashi|
The present invention addresses the problem of achieving a balance between a proof stress ratio (=maximum proof stress divided by the 0.2% proof stress) of 1.1-1.6, and an increase in the bonding reliability of a ball bonding part under HTS of 175-200°C in a bonding wire for a semiconductor device, said bonding wire having a Cu alloy core and a Pd coating layer formed on the surface of the Cu alloy core. The bonding reliability of a ball bonding part under HTS is increased by including, in the wire, one or more of Ni, Zn, Rh, In, Ir, and Pt in a total proportion of 0.03-2 mass%. Among the crystal orientations in the lengthwise direction of the wire as found in the measurement of crystal orientations in relation to a cross-section of the core in a direction perpendicular to the wire axis of the bonding wire, the orientation proportion of crystal orientation<100>, for which the angular difference does not exceed 15 degrees relative to the lengthwise direction of the wire, is at least 50%. The proof stress ratio is kept at or below 1.6 by obtaining an average crystal grain size of 0.9-1.3 μm in a cross-section of the core in a direction perpendicular to the wire axis of the bonding wire.
WO/2016/195138 IGM SEMI-QUANTITATIVE LEPTOSPIROSIS DIAGNOSIS KIT||WO||08.12.2016|
||PCT/KR2015/005640||IMMUNEMED INC.||KIM, Yoon Won|
The present invention relates to: a leptospirosis diagnosis kit comprising a first kit and a second kit; and a diagnosis method using the same, and enables patients with leptospirosis to be distinguished and diagnosed in both epidemic regions and endemic regions.
WO/2016/189758 BONDING WIRE FOR SEMICONDUCTOR DEVICE||WO||01.12.2016|
||PCT/JP2015/076721||NIPPON MICROMETAL CORPORATION||YAMADA, Takashi|
Provided is a Cu bonding wire having a Pd coating layer on the surface thereof, the bonding wire being suitable for vehicle-mounted devices and having improved bonding reliability at ball joints in a high-temperature high-humidity environment. This bonding wire for semiconductor devices includes: a Cu alloy core material; and a Pd coating layer formed on the surface thereof. The bonding wire includes a total of from 0.1 to 100 ppm by mass of one or more types of elements among As, Te, Sn, Sb, Bi, and Se. Thus, the bonding life of ball joints in a high-temperature high-humidity environment is improved, and bonding reliability can be improved. When the Cu alloy core material further includes from 0.011 to 1.2 mass% of one or more of Ni, Zn, Rh, In, Ir, Pt, Ga, and Ge, ball joint reliability in a high-temperature environment of 170°C or higher can be improved. Further, when an alloy skin layer including Au and Pd is formed on the surface of the Pd coating layer, wedge bondability is improved.
WO/2016/182101 OPTICAL CONNECTOR||WO||17.11.2016|
||PCT/KR2015/004819||A.J.WORLD CO., LTD.||CHOI, An Joon|
The present invention provides an optical connector comprising: a body comprising a connection part including a connection groove, a cover part, which comprises an outer surface at which a protruding lock region is formed, a first insertion part formed at one end portion of the connection part, and a second insertion part formed at the other end portion of the connection part; a holder slidably fitted into the connection part and the cover part, and comprising an inner upper surface coming into contact with the outer surface of the connection part and an inner lower surface and inner side surfaces, which come into contact with the lock region of the cover part; a guide protrusion formed to protrude from the side surface of the cover part; and a guide slot formed to be recessed from the inner side surface of the holder and formed along the longitudinal direction of the holder, such that the guide protrusion is inserted thereinto and guided therein, wherein the guide slot includes an unlock region, which gradually increases, in the longitudinal direction of the holder, a vertical distance from the inner upper surface of the holder to a contact point between the guide slot and the guide protrusion with respect to the vertical direction, thereby providing an advantageous effect of minimizing the deformation of the connection part or the cover part, resulting from the pressing of the protrusion, by excluding the protrusion, which is necessary for securing a gap between the connection part and the cover part when the connection part and the cover part are unlocked, formed at the connection part or the cover part.
WO/2016/181579 CLOTH FOR DISPOSABLE TEXTILE PRODUCT, AND DISPOSABLE TEXTILE PRODUCT USING SAME||WO||17.11.2016|
||PCT/JP2015/082637||YAMADA, Kikuo||YAMADA, Kikuo|
Provided is a cloth for a disposable textile product having excellent moisture evaporation and dispersion properties, heat dissipation properties, and moisture permeability. Further provided is a disposable textile product that uses the cloth, said product being superior in terms of wearing comfort and skin contact properties, and having excellent moisture evaporation and dispersion properties, heat dissipation properties, and moisture permeability. The cloth for the disposable textile product is composed of a layered sheet 30 that: comprises breathable first and second fibrous sheets 2, 3, and a textile material 4 that diffuses liquids and is disposed between the first and second fibrous sheets 2, 3; and is formed by layering elastic members 5 together with the first and second fibrous sheets 2, 3 and the fibrous material 4. The layered sheet 30 forms a composite layer 31 obtained by laminating a textile layer that is capable of breathing, and a textile layer that is capable of diffusing liquids. The layered sheet 30 has folding sections 6 comprising protrusions and recesses formed by the composite layer 31, and the layered sheet 30 is provided with elasticity.