检索国际和国家专利汇编
此应用的部分内容目前不可用。
如果这种情况仍然存在,请通过以下方式与我们联系反馈与联系
1. (US20080188622) PROPYLENE-BASED COPOLYMER MATERIAL, FILM MADE THEREFROM, AND METHOD FOR PRODUCING PROPYLENE-BASED COPOLYMER MATERIAL

专利局 : 美国
申请号: 12021372 申请日: 29.01.2008
公布号: 20080188622 公布日: 07.08.2008
公布类型: A1
国际专利分类:
C08L 23/00
C08L 23/16
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
23
Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
C 化学;冶金
08
有机高分子化合物;其制备或化学加工;以其为基料的组合物
L
高分子化合物的组合物
23
Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
02
未用化学后处理改性的
16
乙烯-丙烯或乙烯-丙烯-二烯共聚物
申请人: SUMITOMO CHEMICAL COMPANY, LIMITED
发明人: NOZAWA Hiroshi
代理人: SUGHRUE MION, PLLC
优先权数据: 2007022848 01.02.2007 JP
标题: (EN) PROPYLENE-BASED COPOLYMER MATERIAL, FILM MADE THEREFROM, AND METHOD FOR PRODUCING PROPYLENE-BASED COPOLYMER MATERIAL
摘要:
(EN)

A propylene-based copolymer material is provided which includes 1 to 10% by weight of a propylene-based copolymerized component (1) defined below and 90 to 99% by weight of a propylene-based copolymerized component (2) defined below and which has a melting point not higher than 140° C., wherein the propylene-based copolymerized component (1) is a propylene-based copolymerized component which includes 89 to 97% by weight of propylene units, 0 to 1.5% by weight of ethylene units and 3 to 10% by weight of 1-butene units and which has a melting point within the range of 145° C. to 155° C., and the propylene-based copolymerized component (2) is a propylene-based copolymerized component which includes 80 to 94% by weight of propylene units, 0 to 10% by weight of ethylene units and 0 to 20% by weight of 1-butene units. A film made from the copolymer material is also provided.


Also published as:
JP2008208362DE102008006699