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1. (US20040066628) Rapidly self-heat-conductive heat-dissipating module

专利局 : 美国
申请号: 10603392 申请日: 24.06.2003
公布号: 20040066628 公布日: 08.04.2004
公布类型: A1
国际专利分类:
H05K 7/20
F28F 3/00
F28F 3/02
F28F 13/00
H01L 23/34
H01L 23/367
H01L 23/373
H 电学
05
其他类目不包含的电技术
K
印刷电路;电设备的外壳或结构零部件;电气元件组件的制造
7
对各种不同类型电设备通用的结构零部件
20
便于冷却、通风或加热的改进
F 机械工程;照明;加热;武器;爆破
28
一般热交换
F
通用热交换或传热设备的零部件
3
板状或层压元件;板状或层压元件组件
F 机械工程;照明;加热;武器;爆破
28
一般热交换
F
通用热交换或传热设备的零部件
3
板状或层压元件;板状或层压元件组件
02
有增加传热面积结构,例如有肋片、凹槽或波纹的元件及其组件
F 机械工程;照明;加热;武器;爆破
28
一般热交换
F
通用热交换或传热设备的零部件
13
改变传热的装置,例如增加、减少
H 电学
01
基本电气元件
L
半导体器件;其他类目中不包括的电固体器件
23
半导体或其他固态器件的零部件
34
冷却装置;加热装置;通风装置或温度补偿装置
H 电学
01
基本电气元件
L
半导体器件;其他类目中不包括的电固体器件
23
半导体或其他固态器件的零部件
34
冷却装置;加热装置;通风装置或温度补偿装置
36
为便于冷却或加热对材料或造型的选择,例如散热器
367
为便于冷却的器件造型
H 电学
01
基本电气元件
L
半导体器件;其他类目中不包括的电固体器件
23
半导体或其他固态器件的零部件
34
冷却装置;加热装置;通风装置或温度补偿装置
36
为便于冷却或加热对材料或造型的选择,例如散热器
373
为便于冷却的器件材料选择
申请人:
发明人: Liu Jefferson
代理人: Keith Kline PRO-TECHTOR INT'L SERVICES
优先权数据: 090212712 26.07.2001 TW
标题: (EN) Rapidly self-heat-conductive heat-dissipating module
摘要: front page image
(EN)

A rapidly self-heat-conductive heat-dissipating module is disclosed including: a plurality of heatsinks which are overlapped, but mechanically separable and discontinuous in contacting interface, at least one heat convection super conductive tubes containing high temperature super conductor composites, at least one heat dissipating fans assembled to an identical lateral side of the heatsinks. In addition to serving to buckle heatsinks together, heat convection super conductive tubes containing high temperature super conductor composites transfer heat to heatsink far away from heat generating source rapidly, whereby efficiency of heat dissipating increases. Mechanical separability between buckled heatsinks and discontinuity in contacting interface between heatsinks avoid heat dissipation of heatsink contacting heat source being impaired by the downward heat flow from heatsink far away from heat source. Heat dissipating fans assembled to an identical lateral side of the heatsinks blow cold air to fins of heatsinks to increase heat-dissipating efficiency. Fins of contacting heatsinks can be arranged alternatively to increase heat-dissipating efficiency. A plurality of heatsink sets can be assembled together to form a composite rapidly self-heat-conductive heat-dissipating module to further enhance heat-dissipating efficiency. All characteristics of the present invention mentioned above make rapidly self-heat-conductive heat-dissipating module of the present invention a highly efficient heat-dissipating device.


也发表为:
US20030019610