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1. (WO2019045953) MOLDED DEVICE PACKAGE WITH AIR CAVTIY
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CLAIMS

WHAT IS CLAIMED IS:

1. A package, comprising:

a substrate;

a die above the substrate;

first and second dams between the die and the substrate; and

a mold on the substrate, the mold encapsulating the die and the first and second dams,

wherein inner and outer sidewalls of the first and second dams are substantially vertical,

wherein the outer sidewalls of the first and second dams are either vertically aligned with sidewalls of the die or are outside of the sidewalls of the die, and

wherein an air cavity is formed in the package, the air cavity being bounded above by a lower surface of the die, bounded below by an upper surface of the substrate, and bounded on sides by the inner sidewalls of the first and second dams.

2. The package of claim 1 , wherein a material of the first and second dams is different from a material of the mold.

3. The package of claim 2, wherein the material of the first and second dams is a photoresist (PR) material.

4. The package of claim 1 , further comprising:

a plurality of interconnects between the die and the substrate,

wherein the plurality of interconnects are all within the air cavity.

5. The package of claim 1 ,

wherein the outer sidewalls of the first and second dams are outside of the sidewalls of the die, and

wherein the inner sidewalls of the first and second dams are in contact with portions of the sidewalls of the die.

6. The package of claim 5, wherein the inner sidewalls of the first and second dams are in contact with substantially all sidewalls of the die.

7. The package of claim 6, wherein top surfaces of the first and second dams are planar with a top surface of the die.

8. The package of claim 1, wherein the outer sidewalls of the first and second dams are vertically aligned with the sidewalls of the die.

9. A method, comprising:

forming a substrate;

providing a die above the substrate;

forming first and second dams between the die and the substrate; and forming a mold on the substrate to encapsulate the die and the first and second dams,

wherein the first and second dams are formed such that

inner and outer sidewalls of the first and second dams are substantially vertical, and

the outer sidewalls of the first and second dams are either vertically aligned with sidewalls of the die or are outside of the sidewalls of the die, and

wherein an air cavity is formed in the package, the air cavity being bounded above by a lower surface of the die, bounded below by an upper surface of the substrate, and bounded on sides by the inner sidewalls of the first and second dams.

10. The method of claim 9, wherein a material for forming the first and second dams is different from a material for forming the mold.

11. The method of claim 10, wherein the first and second dams are formed from a photoresist (PR) material.

12. The method of claim 9,

wherein a plurality of interconnects are formed on the lower surface of the die, and

wherein the first and second dams are formed such that the plurality of interconnects are all within the air cavity.

13. The method of claim 9, wherein the first and second dams are formed such that

the outer sidewalls of the first and second dams are outside of the sidewalls of the die, and

the inner sidewalls of the first and second dams are in contact with portions of the sidewalls of the die.

14. The method of claim 13, wherein the first and second dams are formed such that the inner sidewalls of the first and second dams are in contact with substantially all sidewalls of the die.

15. The method of claim 14, wherein the first and second dams are formed such that top surfaces of the first and second dams are planar with a top surface of the die.

16. The method of claim 9, wherein the first and second dams are formed such that the outer sidewalls of the first and second dams are vertically aligned with the sidewalls of the die.

17. The method of claim 9, wherein forming the first and second dams between the die and the substrate comprises:

providing the die on a carrier;

depositing a photoresist (PR) material on the die on the carrier;

patterning the PR material to form the first and second dams;

detaching the die and the first and second dams from the carrier; and

attaching the die and the first and second dams to the substrate to form the air cavity.

18. The method of claim 17, further comprising performing a die reflow and curing the first and second dams subsequent to attaching the die and the first and second dams to the substrate.

19. The method of claim 17, further comprising:

singulating the die from a plurality of dies on a wafer prior to providing the die on the carrier,

wherein providing the die on the carrier comprises providing a plurality of singulated dies on the carrier,

wherein depositing the PR material on the die on the carrier comprises depositing the PR material on the plurality of singulated dies on the carrier, and

wherein patterning the PR material comprises patterning the PR material to form pluralities of first and second dams corresponding to the plurality of singulated dies.

20. The method of claim 17,

wherein the carrier is a wafer such that providing the die on the carrier comprises forming a plurality of dies on the wafer,

wherein depositing the PR material on the die on the carrier comprises depositing the PR material on the plurality of dies on the wafer,

wherein patterning the PR material comprises patterning the PR material to form pluralities of first and second dams corresponding to the plurality of dies, and

wherein the method further comprises singulating the die and the corresponding first and second dams from other dies and other first and second dams subsequent to patterning the PR material.

21. A package, comprising:

a substrate;

a die above the substrate;

means for forming an air cavity between the die and the substrate; and means for encapsulating the die and the means for forming the air cavity on the substrate,

wherein inner and outer sidewalls of the means for forming the air cavity are substantially vertical,

wherein the outer sidewalls of the means for forming the air cavity are either vertically aligned with sidewalls of the die or are outside of the sidewalls of the die, and wherein the air cavity is bounded above by a lower surface of the die, bounded below by an upper surface of the substrate, and bounded on sides by the inner sidewalls of the means for forming the air cavity.